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Institution	Date	Title	Author
義守大學	2013-08	高速串列匯流排實體層FPGA之實現及連結層功能驗證	曾雅惠; Ya-Hui Tseng
義守大學	2012-11	Micro-scale Cu metallization on polyimide substrate for high-speed interconnects	Ya-Hui Tseng;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin

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