| 國立成功大學 |
2008-02 |
Copper concentration dependence of structure, morphology and optical properties of ZnS : Cu,Cl phosphor powder
|
Nien, Yung-Tang; Chen, In-Gann; Hwang, Chii-Shyang; Chu, Sheng-Yuan |
| 臺大學術典藏 |
2021-02-04T07:07:24Z |
Copper concentration simulation in a river by SWAT-WASP integration and its application to assessing the impacts of climate change and various remediation strategies
|
Chueh, Y.-Y.;Fan, C.;Huang, Y.-Z.; Chueh, Y.-Y.; Fan, C.; Huang, Y.-Z.; CHIHHAO FAN |
| 國家衛生研究院 |
2007-07 |
Copper deficiency, lead, and paraoxonase: Li et al. respond
|
Li, WF; Chuang, HY |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Copper direct bonding with short time and excellent electrical property by < 111 >-oriented nano-twinned copper
|
Shie, Kai Cheng; Juang, Jing-Ye; Chen, Chih |
| 國立成功大學 |
2012 |
Copper Electrodeposition on Ru-N Barrier with Various Nitrogen Content for 22 nm Semiconductor Manufacturing Application
|
Wu, Chia-Yang; Wang, Yu-Sheng; Lee, Wen-Hsi |
| 國立交通大學 |
2014-12-08T15:45:37Z |
Copper electroplating for future ultralarge scale integration interconnection
|
Gau, WC; Chang, TC; Lin, YS; Hu, JC; Chen, LJ; Chang, CY; Cheng, CL |
| 國立交通大學 |
2014-12-08T15:44:54Z |
Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000)
|
Gau, WC; Chang, TC; Lin, YS; Hu, JC; Chen, LJ; Chang, CY; Cheng, CL |
| 國立高雄大學 |
2012 |
Copper emission during thermal treatment of simulated copper sludge
|
Chou, Jing-Dong; Lin, Chiou-Liang; Hsien, Yi-Lin; Wey, Ming-Yen; Chang, Shih-Hsien |
| 中山醫學大學 |
2012 |
Copper emission during thermal treatment of simulated copper sludge
|
Jing-Dong Chou;Chiou-Liang Lin;Yi-Lin Hsien;Ming-Yen Wey;Shih-Hsien Chang |
| 國立臺灣大學 |
2006 |
Copper Hydroxide Improved Root Quality of Palimara Alstonia in Plastic Containers
|
Chang, Yu-Sen; Lin, Chen-Yu |
| 臺大學術典藏 |
2006 |
Copper hydroxide improved root quality of palimara alstonia in plastic containers
|
YU-SEN CHANG; Lin, C.-Y.; Chang, Y.-S. |
| 國立中山大學 |
2000 |
Copper induction of phosphate deficiency in Ulva fasciata (Ulvales, Chlorophyta)
|
黃雅玲;李澤民 |
| 國立中山大學 |
2005 |
Copper induction of phosphorus deficiency in Ulva fasciata (Ulvales, Chlorophyta)
|
T.M. Lee;Y.L. Huang;M.H. Chen |
| 國立臺灣大學 |
1994 |
Copper Intake and Health Threat by Consuming Seafood from Copper Contaminated Coastal Environments in Taiwan
|
Han, B. C.; 鄭偉力; 洪楚璋; Jeng, M. S.; Han, B. C.; Jeng, Woei-Lih; Hung, Tsu-Chang; Jeng, M. S. |
| 臺北醫學大學 |
1994 |
Copper intake and health threat by consuming seafood from copper contaminated coastal environments in Taiwan. Environ.
|
韓柏檉; B.C. Han; W.L.Jeng ; M.S.Jeng and T.C.Hung |
| 國立臺灣大學 |
1994 |
COPPER INTAKE AND HEALTH THREAT BY CONSUMING SEAFOOD FROM COPPER-CONTAMINATED COASTAL ENVIRONMENTS IN TAIWAN
|
Han, Bor-Cheng; Jeng, Woei-Lih; Hung, Tsu-Chang; Jeng, Ming-Shiou |
| 國立交通大學 |
2014-12-08T15:17:29Z |
Copper interconnect electromigration behavior in various structures and precise bimodal fitting
|
Lin, MH; Lin, YL; Chang, KP; Sul, KC; Wang, TH |
| 中原大學 |
2001 |
Copper Ion Adsorption On The Porous Copolymer Particles Containing
|
許克瀛; |
| 中原大學 |
2001-11 |
Copper Ion Adsorption On The Porous Copolymer Particles Containing Nitrogen Chelating Group
|
K. Y. Hsu;H. M. Ting; |
| 國立交通大學 |
2014-12-08T15:06:56Z |
Copper Loaded on Sol-Gel-Derived Alumina Adsorbents for Phosphine Removal
|
Hsu, Jung-Nan; Bai, Hsunling; Li, Shou-Nan; Tsai, Chuen-Jinn |
| 國立臺灣大學 |
1992 |
Copper Marginal and Deficient Diets Decrease Aortic Prostacyclin Production and Copper-Dependent Superoxide Dismutase Activity ,and Increase Aortic Lipid Peroxidation in Rats
|
Nelson, S. K.; 黃青真; Mathias, M. M.; Allen, K. G.; Nelson, S. K.; Huang, Ching-Jang; Mathias, M. M.; Allen, K. G. |
| 國立臺灣大學 |
1992-01 |
Copper marginal and deficient diets decrease aortic prostacyclin production and copper-dependent superoxide dismutase activity, and increase aortic lipid peroxidation in rats.
|
Nelson, SK; Huang, CJ; Mathias, MM; Allen, KGD |
| 國立交通大學 |
2014-12-16T06:14:30Z |
Copper metalized ohmic contact electrode of compound device
|
Lee; Cheng-Shih; Chang; Edward Yi; Chen; Ke-Shian |
| 國立交通大學 |
2014-12-16T06:16:05Z |
Copper metalized ohmic contact electrode of compound device
|
Lee, Cheng-Shih; Chang, Edward Yi; Chen, Ke-Shian |
| 中原大學 |
1999 |
Copper Metallization for Future ULSI Technology
|
C.-L. Cheng;W.-C. Gau;C.-T. Chang;Y.-S. Lin;J.-C. Hu;L.-J.Chen;C.-Y. Chang; |
