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Institution	Date	Title	Author
臺大學術典藏	2018-09-10T03:32:26Z	Curing behavior and thermal properties of cyanate ester cured rigid rod epoxy resins	WEI-FANG SU;Chuang, C.-M.;Su, W.-F.;WEI-FANG SU; Su, W.-F.; Chuang, C.-M.; WEI-FANG SU
國立臺灣科技大學	2007	Curing behavior of anionic poly(urethane urea) dispersions crosslinked with partially methylated melamine formaldehyde	Chiu, H.-T.;Huang, Y.-C.;Chiang, C.-H.
國立交通大學	2014-12-08T15:03:05Z	CURING BEHAVIOR OF FULLY AND SEMIINTERPENETRATING POLYMER NETWORKS BASED ON EPOXY AND ACRYLICS	LIN, MS; LEE, ST
國立臺灣大學	1996-01	Curing Behavior, Compatibility and Fracture Toughness of Bismaleimide/Tetrafunctional Epoxy Resin Blends	Lin, K.F.; Chen, J.C.
國立臺灣科技大學	2006	Curing behavior, mechanical properties, intermolecular interaction, and morphology of silicone/polypyrrole/polymer electrolyte composites	Chiu, H.-T.;Wu, J.-H.
國立交通大學	2014-12-08T15:01:16Z	Curing behaviour of compatible interpenetrating polymer networks based on epoxy and methacrylated epoxy	Wang, MW; Lee, CT; Lin, MS
國立臺灣科技大學	2001	Curing characteristics of photopolymer used in the Solid Laser-diode Plotter RP System	Jeng, J.Y.; Wong, Y.S.; Ho, C.T.
國立成功大學	2009-12	Curing conditions of polyarylacetylene prepolymers to obtain thermally resistant materials	Tseng, Wei-Chieh; Chen, Yun; Chang, Geng-Wen
國立成功大學	2005-01	Curing kinetics and reaction-induced homogeneity in networks of poly(4-vinyl phenol) and diglycidylether epoxide cured with amine	Su, Chean-Cheng; Woo, Eamor M.; Huang, Yin-Ping
國立交通大學	2014-12-08T15:44:49Z	Curing kinetics and viscosity change of a two-part epoxy resin during mold filling in resin-transfer molding process	Lee, CL; Wei, KH

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