| 國立交通大學 |
2017-04-21T06:56:14Z |
Finite Element Analysis of an Ultrasonic Vibration Device at High Temperatures
|
Lan Phuong Nguyen; Tsai, Yen-Pin; Hung, Jung-Chung; Hsieh, Yi-Chun; Hung, Chinghua |
| 臺大學術典藏 |
2018-09-10T09:24:45Z |
Finite Element Analysis of Anisotropic Optical Waveguides with Arbitrary Optic-Axis Orientation
|
H. H. Liu; H. C. Chang; HUNG-CHUN CHANG |
| 國立交通大學 |
2014-12-08T15:48:10Z |
Finite element analysis of antireflective silicon nitride sub-wavelength structures for solar cell applications
|
Lee, Huang-Ming; Sahoo, Kartika Chandra; Li, Yiming; Wu, Jong-Ching; Chang, Edward Yi |
| 國立彰化師範大學 |
2010-10 |
Finite Element Analysis of Antireflective Silicon Nitride Sub-wavelength Structures for Solar Cell Applications
|
Lee, Huang-Ming; Sahoo, Kartika Chandra; Li, Yiming; Wu, Jong-Ching; Chang, Edward Yi |
| 臺北醫學大學 |
2000 |
Finite element analysis of brain contusion: A indirect impact study.
|
李勝揚; Huang H-M; Lee M-C; Lee S-Y; Chiu W-D; Pan L-C; Chen C-T |
| 臺北醫學大學 |
2000 |
Finite element analysis of brain contusion: an indirect impact study
|
陳建志; Huang; H.M.; Lee; M.C.; Lee; S.Y.; Chiu; W.D.; Pan; L.C. Chen; C.T. |
| 臺北醫學大學 |
2000 |
Finite element analysis of brain contusion: an indirect impact study
|
黃豪銘; Huang; H.M.; Lee; M.C.; Lee; S.Y.; Chiu; W.D.; Pan; L.C. Chen; C.T. |
| 臺北醫學大學 |
2000 |
Finite element analysis of brain contusion: an indirect impact study.
|
潘力誠; Huang, H.M.; Lee, M.C.; Lee, S.Y.; Chiu, W.D.; Pan, L.C. Chen, C.T. |
| 臺北醫學大學 |
2000 |
Finite element analysis of brain contusion: an indirect impact study.
|
Huang HM; Lee MC; Lee SY;Chiu WT;Pan LC and Chen CT |
| 國立高雄第一科技大學 |
2013.12 |
Finite Element Analysis of Bridge-Vehicle System with Randomness
|
Chang, Tai Ping |
| 臺大學術典藏 |
2018-09-10T06:02:59Z |
Finite Element Analysis of Capacitive Micromachined Ultrasonic Transducer (CMUT) for NDE Applications
|
Manvinder Singh; Vamshi Kommareddy; Manoj Kumar; Sivaramanivas Ramaswamy; Ying Fan; James Barshinger; Wei-Cheng Tian; Kuna Kishore; WEI-CHENG TIAN |
| 臺北醫學大學 |
1994 |
Finite Element Analysis of Cerebral Contusion,
|
黃豪銘; Chu; C.S.; Lin; M.S.; Huang; H.M.; Lee; M.C. |
| 臺北醫學大學 |
2014 |
FINITE ELEMENT ANALYSIS OF CERVICAL SPINE
|
CY, LIN;SY, CHUANG;CJ, CHIANG;YH, TSUANG;WP, CHEN |
| 臺北醫學大學 |
2014 |
FINITE ELEMENT ANALYSIS OF CERVICAL SPINE
|
LIN, CY;CHUANG, SY;CHIANG, CJ;TSUANG, YH;CHEN, WP |
| 臺北醫學大學 |
2014 |
FINITE ELEMENT ANALYSIS OF CERVICAL SPINE WITH DIFFERENT CONSTRAINED TYPES OF TOTAL DISC REPLACEMENT
|
Lin, Chien-Yu;Chuang, Shih-Youeng;Chiang, Chang-Jung;Tsuang, Yang-Hwei;Chen, Weng-Pin |
| 國立交通大學 |
2014-12-08T15:17:54Z |
Finite element analysis of CFT columns subjected to an axial compressive force and bending moment in combination
|
Hu, HT; Huang, CS; Chen, ZL |
| 國立成功大學 |
2005-12 |
Finite element analysis of CFT columns subjected to an axial compressive force and bending moment in combination
|
Hu, Hsuan-Teh; Huang, Chiung-Shiann; Chen, Zhi-Liang |
| 國立彰化師範大學 |
2007-10 |
Finite element analysis of composite porous billet extrusion processing
|
Chen, Dyi-Cheng; You, Ci-Syong |
| 國立臺灣科技大學 |
1995 |
Finite Element Analysis of Contact Problems for Sheet Metal Bending Process
|
Huang, You-Min ; Leu, D. K. |
| 臺大學術典藏 |
2020-01-17T07:47:58Z |
Finite element analysis of contaminant transport in groundwater
|
Sheu, T.W.H.; Chen, Y.H.; TONY W. H. SHEU |
| 臺大學術典藏 |
2018-09-10T06:03:28Z |
Finite Element Analysis of Cross Talk in Ultrasonic Arrays
|
S.-Y. Chen; P.-C. Li; PAI-CHI LI |
| 國立臺灣科技大學 |
2014 |
Finite Element Analysis of Dental Implant Neck Effects on Primary Stability and Osseointegration in a Type IV Bone Mandible
|
Huang Y.-M., Chou I.-C., Jiang C.-P., Wu Y.-S., Lee S.-Y. |
| 國立彰化師範大學 |
2008-04 |
Finite element analysis of double layers alloy wire drawing processes
|
Chen, Dyi-Cheng; Guo, Zih-Yin; Wang, Shu-Jhao |
| 義守大學 |
2006-12 |
Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique
|
Hsiang-Chen Hsu; Yu-Chia Hsu; Hm-Yu Lee; Chang-Lin Yeh; Yi-Shao Lai; Shen-Li Fu |
| 義守大學 |
2006/12/11 |
Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique
|
Hsiang-Chen Hsu ; Yu-Chia Hsu ; Hm-Yu Lee ; Chang-Lin Yeh ; Yi-Shao Lai ; Shen-Li Fu |
