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Institution	Date	Title	Author
國立臺灣大學	2008	Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads	Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H.
臺大學術典藏	2020-01-06T03:11:16Z	Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads	Jain, C. C.; Wang, S. S.; Huang, K. W.; Chuang, T. H.; STEVEN SHENG-SHIH WANG
臺大學術典藏	2020-05-12T02:53:10Z	Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads	Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H.; TUNG-HAN CHUANG
國立交通大學	2019-04-03T06:42:01Z	Intermetallic compounds in 3D integrated circuits technology: a brief review	Annuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning
國立臺灣大學	2006-02	Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Pads	Chuang, T. H.; Yen, S. F.; Cheng, M. D.
臺大學術典藏	2006	Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish	Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min; Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min
國立臺灣大學	2006	Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish	Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min
臺大學術典藏	2020-05-12T02:53:13Z	Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish	Chuang, T.-H.; Yen, S.-F.; Wu, H.-M.; TUNG-HAN CHUANG
國立東華大學	2008	Intermetallic Formation Induced Substrate Dissolution in Electroless Ni(P)-solder Interconnections	Song,J. M.; Liu,Y. R.; Chiu,Y. T.; Lai,Y. S.; Su,C. W.
國立交通大學	2014-12-08T15:05:34Z	INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES	CHIOU, BS; LIU, KC; DUH, JG; PALANISAMY, PS

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