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Institution	Date	Title	Author
臺大學術典藏	2022-03-22T08:27:50Z	Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes	Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:50Z	Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes	Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:52Z	Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes	Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2021-11-21T23:18:55Z	Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes	CHUN-HAO CHEN; Lee, Pei Ing; Yeh, Wei Ting; TUNG-HAN CHUANG
國立中山大學	2001	Intermetallic Growth of Wire-bond at 175 °C High Temperature Aging	Hen-So Chang;J.X. Pon;Ker-Chang Hsieh;C.C. Chen
國立勤益科技大學	1999-06	Intermetallic phase formation and shear strength of a Au-In microjoint	Shieu, F.S.;Chen, C.F.;Sheen, J.G.;Chang, Z.C.
國立成功大學	2014	Intermetallic Phase on the Interface of Ag-Au-Pd/Al Structure	Hsueh, Hao-Wen; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Chen, Kuan-Jen
臺大學術典藏	2018-06-28T22:11:31Z	Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads	Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han; Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han
國立臺灣大學	2005	Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads	Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han
臺大學術典藏	2008	Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish	Chuang, Tung-Han; Wu, Hui-Min; Jain, Chao-Chi; Wang, Shiuan-Sheng; Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han

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