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Showing items 526991-527000 of 2348971 (234898 Page(s) Totally) << < 52695 52696 52697 52698 52699 52700 52701 52702 52703 52704 > >> View [10|25|50] records per page
| 國立交通大學 |
2014-12-08T15:09:16Z |
Investigation of Consensus Problem over Combined Wired/Wireless Network
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Cheng, Chien-Fu; Wang, Shu-Ching; Liang, Tyne |
| 亞洲大學 |
2006 |
Investigation of consumer invoement and behavior for famous-brand fine works :Hsinchu area as an example
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LEE LI CHUAN |
| 國立成功大學 |
2012-04 |
Investigation of Contact Behavior and Design of Vertical Probe for Wafer Level Probing
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Chang, Hao-Yuan; Pan, Wen-Fung; Lin, Shueei-Muh |
| 東方設計學院 |
2009 |
Investigation of continuous and intermittent heating on far-infrared assisted freeze-drying
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King, V. A.-E.; Lin, Y.P.; 林宇平; 金安兒; (東方技術學院食品科技系) |
| 臺大學術典藏 |
2020-05-14T06:59:21Z |
Investigation of controllable heat-triggered micro-bubble generation in a double-channel design for “Air-Bubble Coating
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Y.-W. Hsieh; I.-C. Lin; A.-B. Wang; G.-W. Wu; W.-P. Shih; AN-BANG WANG |
| 國立臺灣大學 |
2011 |
Investigation of controllable heat-triggered micro-bubble generation in a double-channel design for “Air-Bubble Coating”
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Hsieh, Y.-W.; Lin, I.-C.; Wang, A.-B.; Wu, G.-W.; Shih, W.-P. |
| 國立成功大學 |
2003-12 |
Investigation of copper agglomeration at elevated temperatures
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Yang, Ching-Yu; Chen, Jen-Sue |
| 國立高雄師範大學 |
2003-11 |
Investigation of Copper Process by Using PVD
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Ruey-Lue Wang;Ming-Chang Kuo;Yan-Kuin Su;Sun-Chin Wei;Shih-Chieh Hung;Kuo-Chun Huang; 王瑞祿 |
| 國立成功大學 |
2008-09 |
Investigation of copper scratches and void defects after chemical mechanical polishing
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Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang; Hwang, Gwo-Jen |
| 國立臺灣科技大學 |
2015 |
Investigation of Copper-Based Ternary and Quaternary Materials for Photovoltaic Applications
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Melkamu, Walelign Wubet |
Showing items 526991-527000 of 2348971 (234898 Page(s) Totally) << < 52695 52696 52697 52698 52699 52700 52701 52702 52703 52704 > >> View [10|25|50] records per page
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