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| 臺大學術典藏 |
2019-03-11T08:00:57Z |
Package-strain-enhanced device and circuit performance
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Liu, C.W.;Chang, S.T.;Huang, C.-F.;Lee, M.H.;Yuan, F.;Maikap, S.;Liao, M.H.; Maikap, S.; Liao, M.H.; Yuan, F.; Lee, M.H.; Huang, C.-F.; Chang, S.T.; Liu, C.W. |
| 臺大學術典藏 |
2018-09-10T07:42:41Z |
Packaged Symmetric/Asymmetric Corrugated Long Period Fiber Gratings for Refractive Index Sensing Applications
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Chih-Yu Huang,;Wen-Lin Chan,;Shih-Min Chuo,;Jer-Haur Chang,;Li-Lun Chen,;Lon A. Wang,; Chih-Yu Huang,; Wen-Lin Chan,; Shih-Min Chuo,; Jer-Haur Chang,; Li-Lun Chen,; Lon A. Wang,; LON A. WANG |
| 國立成功大學 |
2003-05 |
Packaging a fiber Bragg grating with metal coating for an athermal design
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Lo, Yu-Lung; Kuo, Chih-Ping |
| 國立成功大學 |
2002-02 |
Packaging a fiber Bragg grating without preloading in a simple athermal bimaterial device
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Lo, Yu-Lung; Kuo, Chih-Ping |
| 南台科技大學 |
2003 |
Packaging design for e-commerce: Identifyingnew challenges and opportunities for online packaging
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黃國禮; HUANG, K.L.;RUST, C.;PRESS, M. |
| 義守大學 |
2004-03 |
Packaging Design for Implantable Microstimulator
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Chi-Chan Hung;Cho-Liang Chung;Gin-Shu Young;Kang-Ping Lin;Jia-Jin Chen; 鍾卓良 |
| 國立交通大學 |
2019-04-02T06:04:52Z |
Packaging Effect on the Flow Separation of CMOS Thermoresistive Micro Calorimetric Flow Sensors
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Xu, Wei; Gao, Bo; Lee, Yi-Kuen; Chiu, Yi |
| 國立中山大學 |
2009-05 |
Packaging effects on degrading the figure of merit of a CMOS low-noise amplifier: flip-chip versus wirebond
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F.Y. Han;K.C. Lu;T.S. Horng;J.Y. Li;C.C. Chen;H.H. Chen;C.T. Chiu;C.P Hung |
| 國立中山大學 |
2009-06 |
Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: flip-chip versus wire-bond
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F.Y. Han;K.C. Lu;T.S. Horng;J. Lin;H.H. Cheng;C.T. Chiu;C.P. Hung |
| 國立臺灣科技大學 |
2014 |
Packaging efficiency in phosphor-converted white LEDs and its impact to the limit of luminous efficacy
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Sun, C.-C.;Chang, Y.-Y.;Yang, T.-H.;Chung, T.-Y.;Chen, C.-C.;Lee, T.-X.;Li, D.-R.;Lu, C.-Y.;Ting, Z.-Y.;Glorieux, B.;Chen, Y.-C.;Lai, K.-Y.;Liu, C.-Y. |
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