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显示项目 229806-229855 / 2348971 (共46980页)
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机构 日期 题名 作者
育達商業科技大學 2006/12/1 BOM進銷存管理系統-以PC組裝為例 朱桂慶;高啟堯;陳永展;許敦凱;張禹平;莊維鵬
國立政治大學 2009 Bon Marche: Sustaining technology-use and organizing principles of market-making 蕭瑞麟
國立臺灣科技大學 2011-05-20 Bon Voyage 鄭慈勻
致理技術學院 2018-05 Bon Voyage Caf'e 企劃案 邱昱慈; 王羿婷; 黃姵穎; 蘇富真; 童郁晴
朝陽科技大學 2019-02-25 Bond Behavior of Low-activated High Aluminate Concrete with Reinforcement under Cyclic Load 干裕成
國立臺灣大學 2003 Bond Characteristics of Deformed Reinforcing Bars in Reactive Powder Concrete Chan, Y.W.; Chen, K.X.; Cheng, R.B.
國立臺灣大學 1997 Bond Characterization of Chromium?Fischer Carbene Complexes: A Combined Study of Experiment and Theory Wang, Chih-Chieh; Wang, Yu; Liu, Hui-Jean; Lin, Kuan-Jiuh; Chou, Liang-Kuei; Chan, Kin-Shing
國立臺灣大學 1999 Bond Characterization of Metal Squarate Complexes [MII(C4O4)(H2O)4; M = Fe, Co, Ni, Zn] Lee, Chi-Rung; Wang, Chih-Chieh; Chen, Ko-Chun; Lee, Gene-Hsiang; Wang, Yu
國立臺灣大學 2011 Bond Characterization on a Cr-Cr Quintuple Bond: A Combined Experimental and Theoretical Study Wu, Lai-Chin; Hsu, Chia-Wei; Chuang, Yu-Chun; Lee, Gene-Hsiang; Tsai, Yi-Chou; Wang, Yu
國立臺灣海洋大學 2003-06 Bond Degradation Due to The Desalination Process 張建智
臺大學術典藏 2018-09-10T15:00:11Z Bond distortion in GaPSb alloys studied by reciprocal space mapping and extended X-ray absorption fine structure C. Y. Tsai;M. C. Liu;Y. C. Chin;Z. C. Feng;H. H. Lin; C. Y. Tsai; M. C. Liu; Y. C. Chin; Z. C. Feng; H. H. Lin; HAO-HSIUNG LIN
臺大學術典藏 2021-05-13T06:27:02Z Bond energy effects on strength, cooperativity and robustness of molecular structures CHOU CHIA-CHING
國立交通大學 2014-12-08T15:46:05Z Bond length order parameter of conjugated polymers Lai, CM; Meng, HF
臺大學術典藏 2018-09-10T09:24:39Z Bond lengths and lattice structure of InP0.52Sb0.48 grown on GaAs C. J. Wu;Z. C. Feng;W. M. Chang;C. C. Yang;H. H. Lin; C. J. Wu; Z. C. Feng; W. M. Chang; C. C. Yang; H. H. Lin; HAO-HSIUNG LIN; CHIH-CHUNG YANG
淡江大學 1989-06 Bond lengths in Hg1-xCdxTe and II-VI diluted magnetic semiconductors Pong, Way-Faung; Mayanovic, Robert A.; Bunker, Bruce A.
朝陽科技大學 2022-01-01 Bond Load-Slip Behaviors of Strand Assemblies-in-Cement 許世宗
國立成功大學 2002-01 Bond orbital model with microscopic interface effects Chen, Chun-Nan; Wang, Yeong-Her; Houng, Mau-Phon; Chiang, Jih-Chen
國立中山大學 2002 Bond Orbital Mondel with Microscopic Interface Effects Chun-Nan Chen;Yeonng-Her Wang;Mou-Phon Houng;Jih-Chen Chiang
國立交通大學 2014-12-08T15:15:10Z Bond pad design with low capacitance in CMOS technology for RF applications Hsiao, Yuan-Wen; Ker, Ming-Dou
國立成功大學 2021-02-19 Bond Performance between Ultra-High Performance Concrete and High Strength Steel using Pull-out tests 沙瓦瑪; Kumar, Sarah Ravi
臺大學術典藏 2003 Bond Price Volatility Lyuu, Yuh-Dauh; Lyuu, Yuh-Dauh
臺大學術典藏 2004 Bond Price Volatility Lyuu, Yuh-Dauh; Lyuu, Yuh-Dauh
國立臺灣大學 2003 Bond Price Volatility Lyuu, Yuh-Dauh
國立臺灣大學 2004 Bond Price Volatility Lyuu, Yuh-Dauh
朝陽科技大學 2023-08-18 BOND RESISTANCE OF REPAIRED CRACKED-CONCRETE EMBEDDED WITH REBAR IN VARYING SIZE UNDER CYCLIC LOAD 干裕成; KAN, YU-CHENG; PEI, KUANG-CHIH
國立臺灣大學 1986 Bond Selective Photochemistry in CH2BrI Through Electronic Excitation at 210 nm Butler, L. J.; Hintsa, E. J.; 李遠哲; Butler, L. J.; Hintsa, E. J.; Lee, Yuan-Tseh
國立成功大學 2005-12 Bond strength and debonding characteristics of a new ceramic bracket Liu, Jia-Kuang; Chung, Ching-Hung; Chang, Chuan-Yang; hieh, Dar-Bin
大葉大學 2007-11 Bond strength of binary Ti-Cr alloys to porcelain Hsu, H.C.;Chiang, T.Y.;Wu, S.C.;Lin, H.C.;Ho, W.F.
臺北醫學大學 2006 Bond strength of light curing composite resin with various lights. 王蔚南; Hwang SD; Teng CM; Tsai NC; Hwang HM; Wang WN;
臺北醫學大學 2006 Bond strength of light curing composite resin with various lights.In press. 鄧乃嘉; 李勝揚; 蔡志孟; Hwang SD; Teng NC; Tsai CM; Hwang HM; Wang WN;
臺北醫學大學 2005 Bond strength of light-cured composite resin using various light sources 黃豪銘; Hwang SD; Tsai CM; Teng NC; Huang HM; Lee SY; Wang WN
臺北醫學大學 2010 Bond strength of orthodontic light-cured resin-modified glass ionomer cement CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang
臺北醫學大學 2011 Bond strength of orthodontic light-cured resin-modified glass ionomer cement CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang
臺北醫學大學 2011 Bond strength of orthodontic light-cured resin-modified glass ionomer cement Chen, CY;Chen, CH;Li, CL;Tsai, HH;Chou, TH;Wang, WN
臺北醫學大學 2010 Bond strength of orthodontic light-cured resin-modified glass ionomer cement Chen, CY;Chen, CH;Li, CL;Tsai, HH;Chou, TH;Wang, WN
大葉大學 2013-01 Bond strength of Ti-5Cr based alloys to dental porcelain with Mo addition. HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang;Fang, Lih-Sheng;Hsu, Hsueh-Chuan
臺北醫學大學 2004 Bond strength of various bracket base designs 林利香; 林哲堂; Wei Nan Wang; Chung Hsing Li; Ta Hsiung Chou; Dennis Ding Hwa Wang; Li Hsiang Lin; Che Tong Lin
臺北醫學大學 2004 Bond strength of various bracket base designs 王蔚南; 林哲堂; Wang WNLi CHChou THWang DDHLin LHLin CT
大葉大學 2013-10-19 Bond strengths between Ti-25Nb-xSn alloys and low-fusing porcelain. Hsu, Hsueh-Chuan;Lin, Yi-Hsin;HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang
國立臺灣大學 2003-10 Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee, BS; Hsieh, TT; Lee, YL; Lan, WH; Hsu, YJ; Wen, PH; Lin, CP
臺大學術典藏 2018-09-10T04:25:44Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; CHUN-PIN LIN
臺大學術典藏 2018-09-10T04:25:46Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; BOR-SHIUNN LEE
臺大學術典藏 2018-09-10T04:25:50Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; YUAN-LING LEE
臺大學術典藏 2021-07-05T07:35:52Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee B.-S.; Hsieh T.-T.; YUAN-LING LEE; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P.
臺大學術典藏 2021-07-26T06:53:20Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee B.-S.; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; CHUN-PIN LIN
臺大學術典藏 2021-07-05T03:41:30Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface BOR-SHIUNN LEE; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P.
國立成功大學 2008-03 Bond structure in porous SiOCH low-k film fabricated by ultraviolet irradiation Huang, Chun-Hsien; Huang, Hui-Ling; Hung, Chen I.; Wang, Na-Fu; Wang, Yeong-Her; Houng, Mau-Phon
國立成功大學 2001-01-05 Bond types of molecular orbitals and the photoelectron spectrum Lee, Hsing-Yi; Wang, Shao-Pin; Chang, Tse-Chiang
國立成功大學 2020 Bond-breaking induced lifshitz transition in robust dirac semimetal VAI3 Liu, Y.;Liu, Y.-F.;Gui, X.;Xiang, C.;Zhou, H.-B.;Hsu, C.-H.;Lin, H.;Chang, T.-R.;Xie, W.;Jia, S.
國立成功大學 2016-01 Bond-Pad Charging Protection Design for Charging-Free Reference Transistor Test Structures Lin, Wallace

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