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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 295396-295405 / 2348973 (共234898页)
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| 國立政治大學 |
1991 |
Cross-Hedging Foreign Interest Rates with US.Financial Futures
|
顏錫銘 |
| 南開科技大學 |
2009-05-19 |
Cross-industry Knowledge Integration and Value Creation between Medical and Leisure Industries—A Case Study
|
Cho, Hsiu-Tsu;Chen, Hsiu-Chen;Tsai, Chia-Wen;Lin, Tzu-Chun |
| 國立中山大學 |
2002 |
Cross-informant agreement in reports of environmental behavior and the effect of cross-questioning on report accuracy
|
S.P. Lam; S. Cheng |
| 大葉大學 |
2013-03-25 |
Cross-Injection Film Cooling on a Curved Surface With or Without a Vortical Flow in the Mainstream
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Wu, Pey-Shey;Chen, Kun-Yu;Lin, Yi-Hung |
| 大葉大學 |
2012-06-25 |
Cross-Injection Film Cooling on a Curved Surface With or Without a Vortical Flow in the Mainstream
|
Wu, Pey-Shey;Chen, Kun-Yu;Lin, Yi-Hung |
| 國立臺灣科技大學 |
2009 |
Cross-interaction between au/sn and cu/sn interfacial reactions
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Yen Y.-W.; Tseng H.W.; Zeng K.; Wang S.J.; Liu C.Y. |
| 臺大學術典藏 |
2019-11-27T02:02:40Z |
Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volume
|
C. ROBERT KAO;Kao C.R.;Chang C.C.; Chang C.C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2007 |
Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness
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Chang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert; Chang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert |
| 國立臺灣大學 |
2007 |
Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness
|
Chang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert |
| 國立臺灣大學 |
2004-12 |
Cross-interaction of UBM and soldering pad in flip-chip solder joints
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Tsai, C. M.; Luo, W. C.; Chang, C. W.; Shieh, Y. C.; Kao, and C. R. |
显示项目 295396-295405 / 2348973 (共234898页)
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