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显示项目 432656-432665 / 2348971 (共234898页) << < 43261 43262 43263 43264 43265 43266 43267 43268 43269 43270 > >> 每页显示[10|25|50]项目
| 元智大學 |
2011-09 |
Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate
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Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto |
| 國立臺灣科技大學 |
2019 |
Flip-chip routing with i/o planning considering practical pad assignment constraints
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Yu, T.-C.;Shih, A.-J.;Fang, S.-Y. |
| 國立臺灣科技大學 |
2018 |
Flip-chip routing with IO planning considering practical pad assignment constraints
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Yu T.-C.; Fang S.-Y. |
| 臺大學術典藏 |
2009 |
Flip-chip routing with unified area-I/O pad assignments for package-board co-design
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Fang, J.-W.;Wong, M.D.F.;Chang, Y.-W.; Fang, J.-W.; Wong, M.D.F.; Chang, Y.-W.; YAO-WEN CHANG |
| 臺大學術典藏 |
2020-06-16T06:31:34Z |
Flip-chip routing with unified area-I/O pad assignments for package-board co-design.
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Fang, Jia-Wei;Wong, Martin D. F.;Chang, Yao-Wen; Fang, Jia-Wei; Wong, Martin D. F.; Chang, Yao-Wen; YAO-WEN CHANG |
| 國立虎尾科技大學 |
2007 |
Flip-Chip Underfill Packaging Considering Capillary Force, Pressure Difference, and Inertia Effects
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Lin, Chao-Ming;Chang, Win-Jin;Fang, Te-Hua |
| 臺大學術典藏 |
2018-09-10T09:17:59Z |
Flip-Chip-Assembled $W$-Band CMOS Chip Modules on Ceramic Integrated Passive Device With Transition Compensation for Millimeter-Wave System-in-Package Integration
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Hsin-Chia Lu;Che-Chung Kuo;Po-An Lin;Chen-Fang Tai;Yi-Long Chang;Yu-Sian Jiang;Jeng-Han Tsai;Yue-Ming Hsin;Huei Wang; Hsin-Chia Lu; Che-Chung Kuo; Po-An Lin; Chen-Fang Tai; Yi-Long Chang; Yu-Sian Jiang; Jeng-Han Tsai; Yue-Ming Hsin; Huei Wang; HSIN-CHIA LU |
| 臺大學術典藏 |
2018-09-10T09:18:00Z |
Flip-chip-assembled W-band CMOS chip modules on ceramic integrated passive device with transition compensation for millimeter-wave system-in-package integration
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Lu, H.-C.; Kuo, C.-C.; Lin, P.-A.; Tai, C.-F.; Chang, Y.-L.; Jiang, Y.-S.; Tsai, J.-H.; Hsin, Y.-M.; Wang, H.; HSIN-CHIA LU |
| 國立交通大學 |
2014-12-08T15:48:22Z |
Flip-Chip-Based Multichip Module for Low Phase-Noise V-Band Frequency Generation
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Hsu, Li-Han; Kuylenstierna, Dan; Kozhuharov, Rumen; Gavell, Marcus; Karnfelt, Camilla; Lim, Wee-Chin; Zirath, Herbert; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:44:54Z |
Flip-flop selection for mixed scan and reset design based on test generation and structure of sequential circuits
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Liang, HC; Lee, CL |
显示项目 432656-432665 / 2348971 (共234898页) << < 43261 43262 43263 43264 43265 43266 43267 43268 43269 43270 > >> 每页显示[10|25|50]项目
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