| 國立臺灣科技大學 |
2011 |
Interfacial reaction and electrical characteristics of Cu(RuTaNx) on GaAs: Annealing effects
|
Leau, W.K.;Chu, J.P.;Lin, C.H. |
| 元智大學 |
Jan-15 |
Interfacial Reaction and Mechanical Characterization of Sn-Ag-Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition
|
Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Ting-Chun Yeh; Tsai-Tung Kuo |
| 元智大學 |
Feb-19 |
Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad
|
Ying-Syuan Wu; Pei-Tzu Lee; Wan-Zhen Hsieh; Tsai-Tung Kuo; Cheng-En Ho |
| 元智大學 |
2013-12-1 |
Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations
|
C. H. Kao; H. H. Hua; H. Y. Chan; T. H. Yang; Kuen-Song Lin; Cheng-En Ho |
| 元智大學 |
2013-12-1 |
Interfacial Reaction and Mechanical Reliability of PTH Solder Joints with Different Solder/Surface Finish Combinations
|
Kuen-Song Lin; Cheng-En Ho; Ho-Yang Chan; Shih-Ju Wang; Chin-Hung Kuo |
| 國立交通大學 |
2014-12-08T15:16:20Z |
Interfacial reaction and shear strength of Pb-free SnAg2.5Cu0.86b0.5 and SnAg3.0Cu0.5Sb0.2 solder bumps on Au/Ni(P) metallization
|
Hsu, YC; Huang, YM; Chen, C; Wang, H |
| 國立臺灣大學 |
2012 |
Interfacial Reaction and Wettability of 72Ag-28Cu Braze on CP-Ti Substrate Using Infrared Heating
|
Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E. |
| 臺大學術典藏 |
2018-09-10T09:17:50Z |
Interfacial reaction and wettability of 72Ag-28Cu braze on CP-Ti substrate using infrared heating
|
Lin, Ming-Tsan;Yang, T.E.;Chen, F.Y.;Wu, S.K.;Shiue, R.K.;Yang, T.E.;Chen, F.Y.;Wu, S.K.;Shiue, R.K.;陳炯年;李伯皇;楊博仁;楊偉勛;林明燦;Yu, Linda Chia-Hui;Lee, Po-Huang;Chen, Chiung-Nien;Yang, T.E.;Chen, F.Y.;Nien, Hsiao-Ching;Wu, S.K.;Yang, Wei-Shiung;Shiue, R.K.;SHYI-KAAN WU;Yang, Po-Jen; Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E.; Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E.; Yang, Po-Jen; SHYI-KAAN WU; Shiue, R.K.; Yang, Wei-Shiung; Wu, S.K.; Nien, Hsiao-Ching; Chen, F.Y.; Yang, T.E.; Chen, Chiung-Nien; Lee, Po-Huang; Yu, Linda Chia-Hui; Lin, Ming-Tsan; 林明燦; 楊偉勛; 楊博仁; 李伯皇; 陳炯年 |
| 國立臺灣大學 |
2010 |
Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints
|
Chang, C.C.; Wang, Y.W.; Lai, Y.S.; Kao, C.R. |
| 臺大學術典藏 |
2020-04-28T07:11:48Z |
Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints
|
Chang, C. C.; Wang, Y. W.; Lai, Y. S.; Kao, C. R.; CHIEN-CHENG CHANG |
| 國立交通大學 |
2014-12-08T15:17:35Z |
Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow
|
Chen, Hsiao-Yun; Chen, Chih |
| 國立臺灣大學 |
2002 |
Interfacial Reaction between Liquid Sn-20In-2.8Ag Solder and Ag Substrate
|
Chiang, M. J.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
|
Chiang, M.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2014-05 |
Interfacial Reaction Between Low-Temperature Co-fired Ceramics and NiCuZn Ferrites in Multilayer Composites
|
Hsiang, Hsing-I; Lyu, Bing Jyun; Mei, Li-Then; Hsi, Chi-Shiung |
| 國立臺灣科技大學 |
2019 |
Interfacial reaction between sn and cu-ti alloy (C1990hp)
|
Laksono, A.D.;Chang, J.-S.;Yan, J.;Yen, Yen Y.-W. |
| 國立交通大學 |
2014-12-08T15:09:47Z |
Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction
|
Lin, K. S.; Huang, H. Y.; Chou, C. P. |
| 國立成功大學 |
2019 |
Interfacial reaction between YSZ electrolyte and La 0.7 Sr 0.3 VO 3 perovskite anode for application
|
Liu, C.-Y.;Tsai, S.-Y.;Ni, C.-T.;Fung, K.-Z. |
| 國立成功大學 |
2019-03 |
Interfacial reaction between YSZ electrolyte and La0.7Sr0.3VO3 perovskite anode for application
|
Liu;Chi-Yang;Tsai;Shu-Yi;Ni;Chung-Ta;Fung;Kuan-Zong |
| 國立中山大學 |
1992 |
Interfacial Reaction Characterization in Aluminum Base Composites
|
Y.S. Lo;J.C. Huang |
| 國立臺灣大學 |
2007 |
Interfacial reaction issues for lead-free electronic solders
|
Ho, C. E.; Yang, S. C.; Kao, C. R. |
| 臺大學術典藏 |
2001 |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
|
Yang, T.Y.; Wu, S.K.; Shiue, R.K.; SHYI-KAAN WU; SHYI-KAAN WU;Shiue, R.K.;Wu, S.K.;Yang, T.Y.;SHYI-KAAN WU |
| 國立臺灣大學 |
2001 |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
|
Yang, T. Y.; Wu, S. K.; Shiue, R. K. |
| 臺大學術典藏 |
2020-05-12T02:52:55Z |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
|
Yang, T.Y.; Wu, S.K.; Shiue, R.K.; REN-KAE SHIUE |
| 國立成功大學 |
2004 |
Interfacial reaction of TiO2/NiCuZn ferrites in multilayer composites
|
Hsiang, Hsing-I; Liao, Wen-Chang; Wang, Yu-Ju; Cheng, Ya-Fang |
| 國立交通大學 |
2014-12-08T15:09:55Z |
Interfacial Reactions and Bonding Strength of Sn-xAg-0.5Cu/Ni BGA Solder Joints
|
Lin, K. S.; Huang, H. Y.; Chou, C. P. |
