| 臺大學術典藏 |
2021-01-27T01:37:58Z |
Intermediate Molecular Mass Hyaluronan and CD44 Receptor Interactions Enhance Neutrophil Phagocytosis and IL-8 Production via p38- and ERK1/2-MAPK Signalling Pathways
|
Lu C.-H.;Lin C.-H.;Li K.-J.;Shen C.-Y.;Wu C.-H.;Kuo Y.-M.;Lin T.-S.;Chia-Li Yu;Hsieh S.-C.; Lu C.-H.; Lin C.-H.; Li K.-J.; Shen C.-Y.; Wu C.-H.; Kuo Y.-M.; Lin T.-S.; CHIA-LI YU; Hsieh S.-C. |
| 臺大學術典藏 |
2021-01-29T02:18:54Z |
Intermediate Molecular Mass Hyaluronan and CD44 Receptor Interactions Enhance Neutrophil Phagocytosis and IL-8 Production via p38- and ERK1/2-MAPK Signalling Pathways
|
Lu, Cheng-Hsun; Lin, Chia-Huei; Li, Ko-Jen; CHIEH-YU SHEN; Wu, Cheng-Han; Kuo, Yu-Min; Lin, Ting-Syuan; Yu, Chia-Li; Hsieh, Song-Chou |
| 臺大學術典藏 |
2022-02-09T09:02:10Z |
Intermediate Molecular Mass Hyaluronan and CD44 Receptor Interactions Enhance Neutrophil Phagocytosis and IL-8 Production via p38- and ERK1/2-MAPK Signalling Pathways
|
Lu, Cheng-Hsun; Lin, Chia-Huei; KO-JEN LI; Shen, Chieh-Yu; Wu, Cheng-Han; Kuo, Yu-Min; Lin, Ting-Syuan; Yu, Chia-Li; Hsieh, Song-Chou |
| 臺北醫學大學 |
2004 |
Intermediate Monitor Agent for Integration of Present Medical Software Diagnosis Assistant Out-patient System as an Example_abstract
|
魏聰祐;曾文憲;張博論 |
| 臺北醫學大學 |
2004 |
Intermediate Monitor Agent for Integration of Present Medical Software Diagnosis Assistant Out-patient System as an Example_full
|
魏聰祐;曾文憲;張博論 |
| 國立臺灣大學 |
2015 |
Intermediate Progenitors Facilitate Intracortical Progression of Thalamocortical Axons and Interneurons through CXCL12 Chemokine Signaling
|
Abe, Philipp; Molnar, Zoltan; Tzeng, Yi-Shiuan; Lai, Dar-Ming; Arnold, Sebastian J.; Stumm, Ralf; 賴達明 |
| 國立臺灣大學 |
2007-05 |
Intermediate Storage Behaviour and the Effect of Prechilling on Germination of Japanese Zelkova (Zelkova serrata)
|
Yang, J.C.; S.R. Kuo,; T.P. Lin |
| 臺大學術典藏 |
2018-09-10T06:26:05Z |
Intermediate storage behaviour and the effect of prechilling on germination of Japanese Zelkova (Zelkova serrata) seeds
|
TSAN-PIAO LIN;Lin, T.P.;Kuo, S.R.;Yang, J.C.; Yang, J.C.; Kuo, S.R.; Lin, T.P.; TSAN-PIAO LIN |
| 國立中山大學 |
2005 |
Intermediate wafer level bonding and interface behavior
|
C.T. Pan; P.J. Cheng; M.F. Chen; C.K. Yen |
| 臺大學術典藏 |
2018-09-10T04:12:02Z |
Intermediate-band surface photometry of the edge-on galaxy NGC 4565
|
WEI-HSIN SUNet al.; Wu, H.; Wu, H. |
| 國立臺灣大學 |
2002-03 |
Intermediate-Band Surface Photometry of the Edge-on Galaxy NGC 4565
|
Wu, Hong; Burstein, David; Deng, Zugan; Zhou, Xu; Shang, Zhaohui; Zheng, Zhongyuan; Chen, Jiansheng; Su, Hongjun; Windhorst, Rogier A.; Chen, Wen-ping; Zou, Zhenlong; Xia, Xiaoyang; Jiang, Zhaoji; Ma, Jun; Xue, Suijian; Zhu, Jin; Cheng, Fuzhen; Byun, Yong-Ik; Chen, Rui; Deng, Licai; Fan, Xiaohui; Fang, Li-Zhi; Kong, Xu |
| 東海大學 |
1997 |
Intermediate-coupling theory for the spectral weight of a spin polaron
|
Yang, M.-F. |
| 國立臺灣大學 |
2009 |
Intermediate-Term Oncological Outcomes of Hand-Assisted Laparoscopic Versus Open Bilateral Nephroureterectomy for Dialysis and Kidney Transplant Patients with Upper Urinary Tract Urothelial Carcinoma
|
戴槐青; 賴明坤; 鍾旭東; 黃國皓; 闕士傑; 余宏政; TAI, HUAI-CHING; LAI, MING-KUEN; CHUNG, SHIU-DONG; HUANG, KUO-HOW; CHUEH, SHIH-CHIEH; YU, HONG-JENG |
| 臺大學術典藏 |
2021-08-02T02:32:34Z |
Intermediate-term oncological outcomes of hand-assisted laparoscopic versus open bilateral nephroureterectomy for dialysis and kidney transplant patients with upper urinary tract urothelial carcinoma
|
Tai H.-C.; Lai M.-K.; Chung S.-D.; Huang K.-H.; SHIH-CHIEH CHUEH; Yu H.-J. |
| 臺大學術典藏 |
2021-01-28T02:03:47Z |
Intermediate-term oncological outcomes of hand-assisted laparoscopic versus open bilateral nephroureterectomy for dialysis and kidney transplant patients with upper urinary tract urothelial carcinoma
|
Tai H.-C.; Lai M.-K.; Chung S.-D.; KUO-HOW HUANG; Chueh S.-C.; Yu H.-J. |
| 臺大學術典藏 |
2021-02-02T00:43:24Z |
Intermediate-term oncological outcomes of hand-assisted laparoscopic versus open bilateral nephroureterectomy for dialysis and kidney transplant patients with upper urinary tract urothelial carcinoma
|
Tai H.-C.; Lai M.-K.; Chung S.-D.; Huang K.-H.; Chueh S.-C.; HONG-JENG YU |
| 國立臺灣大學 |
2006 |
Intermediate-Term Outcome of Psychiatric Inpatients with Major Depression
|
曾美智; 鄭懿之; 李宇宙; 李明濱; TSENG, MEI-CHIH; CHENG, I-CHIH; LEE, YUE-JOE; LEE, MING-BEEN |
| 國立臺灣大學 |
2006-08 |
INTERMEDIATE-TERM OUTCOME OF PSYCHIATRIC INPATIENTS WITH MAJOR DEPRESSION
|
曾美智; 鄭懿之; 李宇宙; 李明濱 |
| 臺大學術典藏 |
2018-09-10T05:49:11Z |
Intermediate-term Outcome of Psychiatric Inpatients with Major Depression
|
Ming-Been Lee; MING-BEEN LEE |
| 臺大學術典藏 |
2018-09-10T05:49:13Z |
Intermediate-term outcome of psychiatric inpatients with major depression
|
Tseng, M.-C.;Cheng, I.-C.;Lee, Y.-J.;Lee, M.-B.; MING-BEEN LEE |
| 臺大學術典藏 |
2021-10-26T02:34:52Z |
Intermediate-term outcome of psychiatric inpatients with major depression
|
Tseng M.-C.; Cheng I.-C.; Lee Y.-J.; MING-BEEN LEE |
| 國立臺灣大學 |
2006 |
Intermediate-term Outcome of Psychiatric Inpatients with Major Depression.
|
Tseng, Mei-Chih; Cheng, I-Chih; Lee, Yue-Joe; Lee, Ming-Been |
| 高雄醫學大學 |
2010 |
Intermediate-term outcomes associated with kidney transplantation in recipients 80 years and older: an analysis of the OPTN/UNOS database.
|
郭弘典; Huang E;Poommipanit N;Sampaio MS;Kuo HT;Reddy P;Gritsch HA;Pham PT;Wilkinson A;Danovitch G;Bunnapradist S |
| 國立臺北護理健康大學 |
2003-01 |
Intermediate-term results of endoscopic transaxillary T2-sympathectomy for primary palmar hyperhidrosis
|
Chiou, TS, M;Chen, S, C |
| 國立交通大學 |
2018-08-21T05:54:24Z |
Intermediate-Valence Ytterbium Compound Yb4Ga24Pt9: Synthesis, Crystal Structure, and Physical Properties
|
Sichevych, Olga; Prots, Yurii; Utsumi, Yuki; Akselrud, Lev; Schmidt, Marcus; Burkhardt, Ulrich; Coduri, Mauro; Schnelle, Walter; Bobnar, Matej; Wang, Yu-Ting; Wu, Yu-Han; Tsuei, Ku-Ding; Tjeng, Liu Hao; Grin, Yuri |
| 臺大學術典藏 |
2018-09-10T04:50:40Z |
Intermetal oxo transfer: Isomerization of tungsten-rhenium carbonyl complexes containing oxo and acetylide ligands
|
Lai, N.-S.;Tu, W.-C.;Chi, Y.;Peng, S.-M.;Lee, G.-H.; Lai, N.-S.; Tu, W.-C.; Chi, Y.; Peng, S.-M.; Lee, G.-H.; SHIE-MING PENG |
| 國立臺灣大學 |
1994 |
Intermetal Oxo Transfer:Isomerization of Tungsten-Rhenium Carbonyl Complexes Containing Oxo and Acetylide Ligands
|
Lai, N.; Tu, W.; Chi, Y.; 彭旭明; Lee, G.; Lai, N.; Tu, W.; Chi, Y.; Peng, Shie-Ming; Lee, G. |
| 國立成功大學 |
2004-12 |
Intermetallic compounds and adhesion strength between the Sn-9Zn-1.5Ag-0.5Bi lead-free solder and unfluxed Cu substrate
|
Liu, Chih-Yao; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2003-03-24 |
Intermetallic compounds formation and interfacial adhesion strength of Sn-9Zn-0.5Ag solder alloy hot-dipped on Cu substrate
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立聯合大學 |
2004 |
Intermetallic Compounds Formation of the Sn-9Zn-xAg Lead-free Solders Hot-dipped on Cu Substrate
|
T.C. Chang , . M.C. Wang(王木琴) and M..H. Hon |
| 國立成功大學 |
2003-04-30 |
Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立臺灣大學 |
2002 |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
|
Yu, C. L.; Wang, S. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
|
Yu, C.L.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al 2O3 and Cu/Ti/Si with Sn/In interlayer
|
Chuang, T.-H.; Lin, H.-J.; Tsao, C.-W.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2009-01-06T01:29:28Z |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
|
Tsao, Cheng-Wen; Chuang, Tung-Han; Lin, Hsiu-Jen; Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 國立臺灣大學 |
2002 |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
|
Chiu, M. Y.; Wang, S. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
|
Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S. S.; Tseng, Y. H.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S.S.; Tseng, Y.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2004 |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages
|
Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)
|
TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D. |
| 臺大學術典藏 |
2020-05-12T02:53:15Z |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu Solder Ball Grid Array Packages
|
Cheng, M.D.; Yen, S.F.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages
|
Chuang, T.H.; Chang, S.Y.; Tsao, L.C.; Weng, W.P.; Wu, H.M.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2018-06-28T22:11:27Z |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
|
Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH |
| 國立臺灣大學 |
2003 |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
|
Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M. |
| 國立臺灣大學 |
2002 |
Intermetallic Compounds formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates
|
Chan, Y. C.; Chiu, M. Y.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates
|
Chan, Y.C.; Chiu, M.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Intermetallic compounds formed in In-3Ag solder BGA packages with ENIG and ImAg surface finishes
|
Chuang, T.H.; Jain, C.C.; Wang, S.S.; TUNG-HAN CHUANG |
