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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 558881-558890 / 2348570 (共234857页)
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每页显示[10|25|50]项目
| 國立交通大學 |
2014-12-08T15:03:42Z |
LOW-PRESSURE CHEMICAL-VAPOR-DEPOSITION OF SILICON-CARBIDE THIN-FILMS FROM HEXAMETHYLDISILANE
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CHIU, HT; HSU, JS |
| 國立交通大學 |
2014-12-08T15:40:56Z |
Low-pressure crystallization of sol-gel-derived PbZr0.52Ti0.48O3 thin films at low temperature for low-voltage operation
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Wang, DY; Chien, CH; Chang, CY; Leu, CC; Yang, JY; Chuang, SH; Huang, TY |
| 國立成功大學 |
2000-04 |
Low-pressure deposition of diamond by electron cyclotron resonance microwave plasma chemical vapor deposition
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Chiang, Ming-Jeng; Lung, B. H.; Hon, Min-Hsiung |
| 國立臺灣大學 |
1995 |
Low-pressure diffusion bonding of SAE 316 stainless steel by inserting a superplastic interlayer
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Yeh, M. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Low-pressure diffusion bonding of SAE 316 stainless steel by inserting a superplastic interlayer
|
Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 元智大學 |
Nov-14 |
Low-pressure ethane/nitrogen gas mixture plasma surface modification effect on the wetting and electrochemical performance of polymeric separator for lithium-ion batteries
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Ruey-Shin Juang; Chia-Han Liang; Wei-Chun Ma; Ching-Yuan Tsai; Chun Huang |
| 國立成功大學 |
2016-04-22 |
Low-Pressure Hybrid Chemical Vapor Growth for Efficient Perovskite Solar Cells and Large-Area Module
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Shen, Po-Shen;Chen, Jia-Shin;Chiang, Yu-Hsien;Li, Ming-Hsien;Guo, Tzung-Fang;Chen, Peter |
| 國立成功大學 |
2022-01 |
Low-pressure hydrodistension induces bladder glomerulations in female patients with interstitial cystitis/bladder pain syndrome
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Hsu;Lin-Nei;Tsai;Yuh-Shyan;Tong;Yat-Ching |
| 臺大學術典藏 |
2022-03-22T08:27:23Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
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Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:22Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
显示项目 558881-558890 / 2348570 (共234857页)
<< < 55884 55885 55886 55887 55888 55889 55890 55891 55892 55893 > >>
每页显示[10|25|50]项目
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