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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 605611-605620 / 2348487 (共234849页)
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每页显示[10|25|50]项目
| 國立高雄應用科技大學 |
2007 |
Nanoindentation characterization of ZnO thin films
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Fang, Te-Hua;Chang, Win-Jin;Lin, Chao-Ming |
| 國立虎尾科技大學 |
2006 |
Nanoindentation characterization of ZnO thin films
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Fang , Te-Hua;Chang, Win-Jin;Lin, Chao-Ming |
| 國立中山大學 |
2009 |
Nanoindentation creep behavior of interfacial intermetallic compounds in electronic solder joints
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C.W. Su;J.M. Song;P.R. Huang;Y.S. Lai;Y.T. Chiu |
| 國立中山大學 |
2009 |
Nanoindentation creep of interfacial intermetallic compounds in electronic solder joints
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C.W. Su;J.M. Song;Y.S. Lai;Y.T. Chiu |
| 國立中山大學 |
2009 |
Nanoindentation creep of interfacial intermetallic compounds in electronic solder joints
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C.W. Su;J.M. Song;Y.S. Lai;.T. Chiu |
| 國立成功大學 |
2014-03-01 |
Nanoindentation fracture and fatigue characterization of PECVD silicon nitride films subjected to rapid thermal annealing
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Huang, Zhi-Kai; Chen, Kuo-Shen |
| 臺大學術典藏 |
2020-01-13T08:17:23Z |
Nanoindentation hardness tests using a point contact microscope
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Lu, C.J.; Bogy, D.; Kaneko, R.; CHUNG-JEN LU |
| 義守大學 |
2008-06 |
Nanoindentation identifications of mechanical properties Of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
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Ping-Feng Yang;Yi-Shao Lai;Sheng-Rui Jian;Jiunn Chen;Rong-Sheng Chen |
| 國立成功大學 |
2008-06-25 |
Nanoindentation identifications of mechanical properties Of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
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Yang, Ping-Feng; Lai, Yi-Shao; Jian, Sheng-Rui; Chen, Jiunn; Chen, Rong-Sheng |
| 國立交通大學 |
2014-12-08T15:39:31Z |
Nanoindentation investigation of amorphous hydrogenated carbon thin films deposited by ECR-MPCVD
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Han, SR; Fang, TH; Chuu, DS |
显示项目 605611-605620 / 2348487 (共234849页)
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每页显示[10|25|50]项目
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