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機構 日期 題名 作者
臺大學術典藏 2022-08-09T03:50:44Z Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation Lo H.C; Wu J.J; Wen C.Y; Wong T.S; Lin S.T; Chen K.H; Chen L.C; Lo H.C; Wu J.J; Wen C.Y; Wong T.S; Lin S.T; Chen K.H; Chen L.C; LI-CHYONG CHEN
國立臺灣大學 2002-11 Bonding Characterization, Density Measurement and Thermal Diffusivity Studies of Amorphous Silicon Carbon Nitride and Boron Carbon Nitride Thin Films Chattopadhyay S; Chen LC; Chien SC
臺大學術典藏 2020-01-06T03:11:07Z Bonding characterization, density measurement, and thermal diffusivity studies of amorphous silicon carbon nitride and boron carbon nitride thin films Chattopadhyay, S.; Chen, L. C.; Chien, S. C.; Lin, S. T.; Chen, K. H.; SHIANG-TAI LIN
朝陽科技大學 2010 BONDING FRACTIONATION OF ANIONIC / CATIONIC CHROMIUM IN SOIL AND INFLUENCE OF pH ON SOIL WASHING EFFICIENCY 章日行; S. F. Cheng; Y. T. Tu; C. M. Kao; J. H. Chang; C. Y. Huang ; C.W. Chen
國立成功大學 2000-08-18 Bonding geometry and reactivity of methoxy and ethoxy groups adsorbed on powdered TiO2 Wu, Wen-Chun; Chuang, Chih-Chung; Lin, Jong-Liang
臺大學術典藏 2003 Bonding interaction, low-lying states and excited charge-transfer states of pyridine-metal clusters: Pyridine-Mn (M = Cu, Ag, Au; n = 2-4) Wu, D. Y.; Hayashi, M.; Chang, C. H.; Liang, K. K.; Lin, S. H.
國立交通大學 2014-12-08T15:37:06Z Bonding line-patterned In0.5Ga0.5P layer on GaP substrate for the successive growth of high-brightness LED structures Liu, PC; Wu, YCS
臺北醫學大學 1994 Bonding Mechanism Between the Components of the Cortrel Dubousset Instrumentations 黃豪銘; Liu; C.L.; Kao; H.C.; Lo; W.H.; Huang; H.M.
國立交通大學 2014-12-16T06:13:59Z Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof Chen Kuan-Neng; Hsu Sheng-Yao
國立交通大學 2014-12-16T06:15:00Z BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-DIMENSIONAL INTEGRATED CIRCUIT THEREOF CHEN KUAN-NENG; Hsu Sheng-Yao

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