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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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顯示項目 229876-229885 / 2348971 (共234898頁) << < 22983 22984 22985 22986 22987 22988 22989 22990 22991 22992 > >> 每頁顯示[10|25|50]項目
| 臺大學術典藏 |
2022-08-09T03:50:44Z |
Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation
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Lo H.C; Wu J.J; Wen C.Y; Wong T.S; Lin S.T; Chen K.H; Chen L.C; Lo H.C; Wu J.J; Wen C.Y; Wong T.S; Lin S.T; Chen K.H; Chen L.C; LI-CHYONG CHEN |
| 國立臺灣大學 |
2002-11 |
Bonding Characterization, Density Measurement and Thermal Diffusivity Studies of Amorphous Silicon Carbon Nitride and Boron Carbon Nitride Thin Films
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Chattopadhyay S; Chen LC; Chien SC |
| 臺大學術典藏 |
2020-01-06T03:11:07Z |
Bonding characterization, density measurement, and thermal diffusivity studies of amorphous silicon carbon nitride and boron carbon nitride thin films
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Chattopadhyay, S.; Chen, L. C.; Chien, S. C.; Lin, S. T.; Chen, K. H.; SHIANG-TAI LIN |
| 朝陽科技大學 |
2010 |
BONDING FRACTIONATION OF ANIONIC / CATIONIC CHROMIUM IN SOIL AND INFLUENCE OF pH ON SOIL WASHING EFFICIENCY
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章日行; S. F. Cheng; Y. T. Tu; C. M. Kao; J. H. Chang; C. Y. Huang ; C.W. Chen |
| 國立成功大學 |
2000-08-18 |
Bonding geometry and reactivity of methoxy and ethoxy groups adsorbed on powdered TiO2
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Wu, Wen-Chun; Chuang, Chih-Chung; Lin, Jong-Liang |
| 臺大學術典藏 |
2003 |
Bonding interaction, low-lying states and excited charge-transfer states of pyridine-metal clusters: Pyridine-Mn (M = Cu, Ag, Au; n = 2-4)
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Wu, D. Y.; Hayashi, M.; Chang, C. H.; Liang, K. K.; Lin, S. H. |
| 國立交通大學 |
2014-12-08T15:37:06Z |
Bonding line-patterned In0.5Ga0.5P layer on GaP substrate for the successive growth of high-brightness LED structures
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Liu, PC; Wu, YCS |
| 臺北醫學大學 |
1994 |
Bonding Mechanism Between the Components of the Cortrel Dubousset Instrumentations
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黃豪銘; Liu; C.L.; Kao; H.C.; Lo; W.H.; Huang; H.M. |
| 國立交通大學 |
2014-12-16T06:13:59Z |
Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof
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Chen Kuan-Neng; Hsu Sheng-Yao |
| 國立交通大學 |
2014-12-16T06:15:00Z |
BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-DIMENSIONAL INTEGRATED CIRCUIT THEREOF
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CHEN KUAN-NENG; Hsu Sheng-Yao |
顯示項目 229876-229885 / 2348971 (共234898頁) << < 22983 22984 22985 22986 22987 22988 22989 22990 22991 22992 > >> 每頁顯示[10|25|50]項目
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