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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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顯示項目 229881-229890 / 2348973 (共234898頁)
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| 臺大學術典藏 |
2003 |
Bonding interaction, low-lying states and excited charge-transfer states of pyridine-metal clusters: Pyridine-Mn (M = Cu, Ag, Au; n = 2-4)
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Wu, D. Y.; Hayashi, M.; Chang, C. H.; Liang, K. K.; Lin, S. H. |
| 國立交通大學 |
2014-12-08T15:37:06Z |
Bonding line-patterned In0.5Ga0.5P layer on GaP substrate for the successive growth of high-brightness LED structures
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Liu, PC; Wu, YCS |
| 臺北醫學大學 |
1994 |
Bonding Mechanism Between the Components of the Cortrel Dubousset Instrumentations
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黃豪銘; Liu; C.L.; Kao; H.C.; Lo; W.H.; Huang; H.M. |
| 國立交通大學 |
2014-12-16T06:13:59Z |
Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof
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Chen Kuan-Neng; Hsu Sheng-Yao |
| 國立交通大學 |
2014-12-16T06:15:00Z |
BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-DIMENSIONAL INTEGRATED CIRCUIT THEREOF
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CHEN KUAN-NENG; Hsu Sheng-Yao |
| 臺大學術典藏 |
2021-09-21T23:19:31Z |
Bonding microwave absorbing ferrites to thermal conducting copper
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Chen, Guan Ren; WEI-HSING TUAN |
| 臺大學術典藏 |
2022-03-22T08:27:54Z |
Bonding microwave absorbing ferrites to thermal conducting copper
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Chen G.-R;Tuan W.-H.; Chen G.-R; Tuan W.-H.; WEI-HSING TUAN |
| 臺大學術典藏 |
2022-03-22T08:30:54Z |
Bonding microwave absorbing ferrites to thermal conducting copper
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Chen G.-R;Tuan W.-H.; Chen G.-R; Tuan W.-H.; WEI-HSING TUAN |
| 臺大學術典藏 |
2022-03-22T08:30:56Z |
Bonding microwave absorbing ferrites to thermal conducting copper
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Chen G.-R;Tuan W.-H.; Chen G.-R; Tuan W.-H.; WEI-HSING TUAN |
| 國立成功大學 |
2009-11 |
Bonding of a complicated polymer microchannel system for study of pressurized liquid flow characteristics with the electric double effect
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Ko, H. S.; Gau, C. |
顯示項目 229881-229890 / 2348973 (共234898頁)
<< < 22984 22985 22986 22987 22988 22989 22990 22991 22992 22993 > >>
每頁顯示[10|25|50]項目
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