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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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顯示項目 229911-229920 / 2348971 (共234898頁)
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每頁顯示[10|25|50]項目
| 元智大學 |
2010-12 |
Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate
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Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang |
| 元智大學 |
2010-12 |
Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate
|
Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang |
| 元智大學 |
2010-12 |
Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate
|
Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang |
| 國立交通大學 |
2014-12-08T15:28:24Z |
Bonding Temperature Optimization and Property Evolution of SU-8 Material in Metal/Adhesive Hybrid Wafer Bonding
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Chen, K. N.; Cheng, C. A.; Huang, W. C.; Ko, C. T. |
| 淡江大學 |
2019-04 |
Bonding ties, bridging ties, and firm performance: the moderating role of dynamic capabilities
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Chang, Y. S. |
| 國立成功大學 |
2018 |
Bonding Within Crystal Structures
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Fang;Tsang-Tse |
| 臺大學術典藏 |
2003 |
BondingPlus: A Real-Time LAN Transmission Model using Regular Switching Hub
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Lin, Hsin-Hung; Hsueh, Chih-Wen; Huang, Guo-Chiuan; Lin, Hsin-hung; Hsueh, Chih-wen; Huang, Guo-Chiuan |
| 國立臺灣大學 |
2003 |
BondingPlus: A Real-Time LAN Transmission Model using Regular Switching Hub
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Lin, Hsin-hung; Hsueh, Chih-wen; Huang, Guo-Chiuan |
| 國立政治大學 |
2002 |
Bonds Valuation and Agency Problems--A Contingent Claims Approach under Optimal Capital Structure
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廖四郎;G. C. Lyu;H. H. Huang; 呂桔誠;廖四郎;黃星華 |
| 亞洲大學 |
2015/04 |
BONE
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姚俊旭;Yao, Chun-Hsu |
顯示項目 229911-229920 / 2348971 (共234898頁)
<< < 22987 22988 22989 22990 22991 22992 22993 22994 22995 22996 > >>
每頁顯示[10|25|50]項目
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