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顯示項目 355181-355190 / 2348973 (共234898頁)
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| 國立交通大學 |
2014-12-08T15:45:02Z |
Effect of coplanar probe pad design on noise figures of 0.35 mu m MOSFETs
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Su, CY; Chen, LP; Chang, SJ; Huang, GW; Ho, YP; Tseng, BM; Lin, DC; Lee, HY; Kuan, JF; Deng, YM; Chen, CL; Leu, LY; Wen, KA; Chang, CY |
| 國立成功大學 |
2000-07-20 |
Effect of coplanar probe pad design on noise figures of 0.35 mu m MOSFETs
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Su, Chia-Yi; Chen, Liang-Po; Chang, Shoou-Jinn; Huang, Guo-Wei; Ho, Y. P.; Tseng, B. M.; Lin, D. C.; Lee, H. Y.; Kuan, J. F.; Deng, Yu-Min; Chen, C. L.; Leu, L. Y.; Wen, K. A.; Chang, Chuan-Yu |
| 國立成功大學 |
2005-06-21 |
Effect of copolymer and additive concentrations on the behaviors of mesoporous tungsten oxide
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Lai, W. H.; Shieh, J.; Teoh, L. G.; Hung, I-Ming; Liao, C. S.; Hon, Min-Hsiung |
| 國立交通大學 |
2014-12-08T15:43:15Z |
Effect of copolymer composition on the miscibility of poly(styrene-co-acetoxystyrene) with phenolic resin
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Kuo, SW; Chang, FC |
| 國立交通大學 |
2014-12-08T15:04:43Z |
EFFECT OF COPPER ADDITIVE ON THE MICROSTRUCTURE AND ELECTRICAL-PROPERTIES OF POLYCRYSTALLINE ZINC-OXIDE
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CHIOU, BS; CHUNG, MC |
| 國立暨南國際大學 |
2010 |
Effect of copper barrier dielectric deposition process on characterization of copper interconnect
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鄭義榮?; Cheng, YL |
| 國立暨南國際大學 |
2010 |
Effect of copper barrier dielectric deposition process on characterization of copper interconnect
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邱泰榮?; Chiu, TJ |
| 國立暨南國際大學 |
2010 |
Effect of copper barrier dielectric deposition process on characterization of copper interconnect
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王煥中?; Wang, HJ |
| 國立暨南國際大學 |
2010 |
Effect of copper barrier dielectric deposition process on characterization of copper interconnect
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王英郎?; Wang, YL |
| 淡江大學 |
2014-06 |
Effect of Copper Channel Widths on the Performance of Direct Methanol Fuel Cells Under Various Operating Temperatures
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Chung, C-W; Lin, J-S; Wang, J-S; Luo, W-J; Chen, Z-Y; Chen, C-N |
顯示項目 355181-355190 / 2348973 (共234898頁)
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