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顯示項目 381001-381010 / 2348971 (共234898頁)
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| 國立交通大學 |
2014-12-08T15:24:03Z |
Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish
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Chu, Ming-Hui; Liang, S. W.; Chen, Chih; Huang, Annie T. |
| 國立交通大學 |
2014-12-08T15:25:59Z |
Electromigration failure mechanism of Sn96.5Ag3.5 flip-chip solder bumps
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Shao, TL; Chen, IH; Chen, C |
| 國立交通大學 |
2014-12-08T15:37:26Z |
Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr-Cu/Cu and Ni(P)/Au metallization pads
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Shao, TL; Chen, YH; Chiu, SH; Chen, C |
| 國立成功大學 |
2020 |
Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging
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Liang, C.-L.;Lin, Y.-S.;Kao, C.-L.;Tarng, D.;Wang, S.-B.;Hung, Y.-C.;Lin, K.-L. |
| 國立交通大學 |
2017-04-21T06:49:13Z |
Electromigration Immortality of Purely Intermetallic Micro -bump for 3D Integration
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Chen, Hsiao-Yun; Tung, Chih-Hang; Hsiao, Yi-Li; Wu, Jyun-lin; Yeh, Tung-Ching; Lin, Larry Liang-Chen; Chen, Chih; Yu, Douglas Cheng-Hua |
| 元智大學 |
Aug-16 |
Electromigration in 3D-IC Scale Cu/Sn/Cu Solder Joints
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Cheng-En Ho; Pei-Tzu Lee; Chih-Nan Chen; Cheng-Hsien Yang |
| 國立交通大學 |
2014-12-08T15:25:35Z |
Electromigration in eutectic SnPb solder bumps with Ni/Cu UBM
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Chiu, SH; Liang, SW; Chen, C; Lin, SS; Chou, CM; Liu, YC; Chen, KH |
| 國立臺灣大學 |
2010 |
Electromigration in flip chip solder joints under extra high current density
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Lin, Y.W.; Ke, J.H.; Chuang, H.Y.; Lai, Y.S.; Kao, C.R. |
| 國立交通大學 |
2017-04-21T06:49:07Z |
Electromigration in microbumps with Cu-Sn intermetallic compounds
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Chu, Yi-Cheng; Zhan, Chau-Jie; Lin, Han-Wen; Huang, Yu-Wei; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:18:38Z |
Electromigration in pb-free SnAg3.8Cu0.7 solder stripes
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Hsu, YC; Chou, CK; Liu, PC; Chen, C; Yao, DJ; Chou, T; Tu, KN |
顯示項目 381001-381010 / 2348971 (共234898頁)
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