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顯示項目 432651-432660 / 2348973 (共234898頁) << < 43261 43262 43263 43264 43265 43266 43267 43268 43269 43270 > >> 每頁顯示[10|25|50]項目
| 南台科技大學 |
2006-08 |
Flip-chip p(GaN)-i(GaN)-n(AlGaN) narrow-band UV-A photo sensors
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T. K. Ko; S. C. Shei; S. J. Chang; Y. K. Su; Y. Z. Chiou; Y. C. Lin; C. S. Chang; W. S. Chen; C. K. Wang; J. K. Sheu; W. C. Lai;林永春 |
| 國立成功大學 |
2006-08 |
Flip-chip p(GaN)-i(GaN)-n(AlGaN) narrowband UV-A photosensors
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Ko, T. K.; Shei, Shih-Chang; Chang, Shoou-Jinn; Su, Yan-Kuin; Chiou, Yu-Zung; Lin, Y. C.; Chang, C. S.; Chen, W. S.; Wang, C. K.; Sheu, Jinn-Kong; Lai, W. C. |
| 國立交通大學 |
2014-12-08T15:29:06Z |
Flip-Chip Packaging of In0.6Ga0.4As MHEMT Device on Low-Cost Organic Substrate for W-Band Applications
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Lim, Wee Chin; Wang, Chin-Te; Kuo, Chien-I; Hsu, Li-Han; Tsai, Szu-Ping; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:27:17Z |
Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate
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Wang, Chin-Te; Kuo, Chien-I; Hsu, Heng-Tung; Chang, Edward Yi; Hsu, Li-Han; Lim, Wee-Chin; Miyamoto, Yasuyuki |
| 元智大學 |
2011-09 |
Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate
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Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto |
| 元智大學 |
2011-09 |
Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate
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Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto |
| 國立臺灣科技大學 |
2019 |
Flip-chip routing with i/o planning considering practical pad assignment constraints
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Yu, T.-C.;Shih, A.-J.;Fang, S.-Y. |
| 國立臺灣科技大學 |
2018 |
Flip-chip routing with IO planning considering practical pad assignment constraints
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Yu T.-C.; Fang S.-Y. |
| 臺大學術典藏 |
2009 |
Flip-chip routing with unified area-I/O pad assignments for package-board co-design
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Fang, J.-W.;Wong, M.D.F.;Chang, Y.-W.; Fang, J.-W.; Wong, M.D.F.; Chang, Y.-W.; YAO-WEN CHANG |
| 臺大學術典藏 |
2020-06-16T06:31:34Z |
Flip-chip routing with unified area-I/O pad assignments for package-board co-design.
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Fang, Jia-Wei;Wong, Martin D. F.;Chang, Yao-Wen; Fang, Jia-Wei; Wong, Martin D. F.; Chang, Yao-Wen; YAO-WEN CHANG |
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