| 臺大學術典藏 |
2018-09-10T04:50:40Z |
Intermetal oxo transfer: Isomerization of tungsten-rhenium carbonyl complexes containing oxo and acetylide ligands
|
Lai, N.-S.;Tu, W.-C.;Chi, Y.;Peng, S.-M.;Lee, G.-H.; Lai, N.-S.; Tu, W.-C.; Chi, Y.; Peng, S.-M.; Lee, G.-H.; SHIE-MING PENG |
| 國立臺灣大學 |
1994 |
Intermetal Oxo Transfer:Isomerization of Tungsten-Rhenium Carbonyl Complexes Containing Oxo and Acetylide Ligands
|
Lai, N.; Tu, W.; Chi, Y.; 彭旭明; Lee, G.; Lai, N.; Tu, W.; Chi, Y.; Peng, Shie-Ming; Lee, G. |
| 國立成功大學 |
2004-12 |
Intermetallic compounds and adhesion strength between the Sn-9Zn-1.5Ag-0.5Bi lead-free solder and unfluxed Cu substrate
|
Liu, Chih-Yao; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2003-03-24 |
Intermetallic compounds formation and interfacial adhesion strength of Sn-9Zn-0.5Ag solder alloy hot-dipped on Cu substrate
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立聯合大學 |
2004 |
Intermetallic Compounds Formation of the Sn-9Zn-xAg Lead-free Solders Hot-dipped on Cu Substrate
|
T.C. Chang , . M.C. Wang(王木琴) and M..H. Hon |
| 國立成功大學 |
2003-04-30 |
Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立臺灣大學 |
2002 |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
|
Yu, C. L.; Wang, S. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
|
Yu, C.L.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al 2O3 and Cu/Ti/Si with Sn/In interlayer
|
Chuang, T.-H.; Lin, H.-J.; Tsao, C.-W.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2009-01-06T01:29:28Z |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
|
Tsao, Cheng-Wen; Chuang, Tung-Han; Lin, Hsiu-Jen; Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 國立臺灣大學 |
2002 |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
|
Chiu, M. Y.; Wang, S. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
|
Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S. S.; Tseng, Y. H.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S.S.; Tseng, Y.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2004 |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages
|
Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)
|
TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D. |
| 臺大學術典藏 |
2020-05-12T02:53:15Z |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu Solder Ball Grid Array Packages
|
Cheng, M.D.; Yen, S.F.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages
|
Chuang, T.H.; Chang, S.Y.; Tsao, L.C.; Weng, W.P.; Wu, H.M.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2018-06-28T22:11:27Z |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
|
Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH |
| 國立臺灣大學 |
2003 |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
|
Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M. |
| 國立臺灣大學 |
2002 |
Intermetallic Compounds formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates
|
Chan, Y. C.; Chiu, M. Y.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates
|
Chan, Y.C.; Chiu, M.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Intermetallic compounds formed in In-3Ag solder BGA packages with ENIG and ImAg surface finishes
|
Chuang, T.H.; Jain, C.C.; Wang, S.S.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2008 |
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads
|
Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H. |
| 臺大學術典藏 |
2020-01-06T03:11:16Z |
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads
|
Jain, C. C.; Wang, S. S.; Huang, K. W.; Chuang, T. H.; STEVEN SHENG-SHIH WANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads
|
Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立交通大學 |
2019-04-03T06:42:01Z |
Intermetallic compounds in 3D integrated circuits technology: a brief review
|
Annuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning |
| 國立臺灣大學 |
2006-02 |
Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Pads
|
Chuang, T. H.; Yen, S. F.; Cheng, M. D. |
| 臺大學術典藏 |
2006 |
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min; Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min |
| 國立臺灣大學 |
2006 |
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min |
| 臺大學術典藏 |
2020-05-12T02:53:13Z |
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
|
Chuang, T.-H.; Yen, S.-F.; Wu, H.-M.; TUNG-HAN CHUANG |
| 國立東華大學 |
2008 |
Intermetallic Formation Induced Substrate Dissolution in Electroless Ni(P)-solder Interconnections
|
Song,J. M.; Liu,Y. R.; Chiu,Y. T.; Lai,Y. S.; Su,C. W. |
| 國立交通大學 |
2014-12-08T15:05:34Z |
INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES
|
CHIOU, BS; LIU, KC; DUH, JG; PALANISAMY, PS |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
|
Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:50Z |
Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
|
Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:52Z |
Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
|
Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-11-21T23:18:55Z |
Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
|
CHUN-HAO CHEN; Lee, Pei Ing; Yeh, Wei Ting; TUNG-HAN CHUANG |
| 國立中山大學 |
2001 |
Intermetallic Growth of Wire-bond at 175 °C High Temperature Aging
|
Hen-So Chang;J.X. Pon;Ker-Chang Hsieh;C.C. Chen |
| 國立勤益科技大學 |
1999-06 |
Intermetallic phase formation and shear strength of a Au-In microjoint
|
Shieu, F.S.;Chen, C.F.;Sheen, J.G.;Chang, Z.C. |
| 國立成功大學 |
2014 |
Intermetallic Phase on the Interface of Ag-Au-Pd/Al Structure
|
Hsueh, Hao-Wen; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Chen, Kuan-Jen |
| 臺大學術典藏 |
2018-06-28T22:11:31Z |
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads
|
Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han; Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han |
| 國立臺灣大學 |
2005 |
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads
|
Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han |
| 臺大學術典藏 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
|
Chuang, Tung-Han; Wu, Hui-Min; Jain, Chao-Chi; Wang, Shiuan-Sheng; Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
|
Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish
|
Jain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads
|
Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H. |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads
|
Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
