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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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顯示項目 918056-918065 / 2348487 (共234849頁)
<< < 91801 91802 91803 91804 91805 91806 91807 91808 91809 91810 > >>
每頁顯示[10|25|50]項目
| 臺大學術典藏 |
2022-04-26T06:17:51Z |
Wafer Bin Map Recognition with Autoencoder-based Data Augmentation in Semiconductor Assembly Process
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Shen P;Lee C.; Shen P; Lee C.; CHIA-YEN LEE |
| 國立成功大學 |
2022 |
Wafer Bin Map Recognition with Autoencoder-Based Data Augmentation in Semiconductor Assembly Process
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Shen, P.-C.;Lee, C.-Y. |
| 國立交通大學 |
2014-12-08T15:44:55Z |
Wafer bonding by low-temperature soldering
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Lee, C; Huang, WF; Shie, JS |
| 國立交通大學 |
2014-12-08T15:40:21Z |
Wafer bonding by Ni-induced crystallization of amorphous silicon
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Chao, CP; Wu, YCS; Lee, TL; Wang, YH |
| 國立交通大學 |
2014-12-08T15:19:18Z |
Wafer bonding for high-brightness light-emitting diodes via indium tin oxide intermediate layers
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Liu, PC; Hou, CY; Wu, YCS |
| 國立彰化師範大學 |
2000 |
Wafer Bonding of 50 Mms Diameter Mirror Substrate to AlGaInP Light-emitting Diode Wafer
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Seieh, C. H. ; Horng, R. H. ; Huang, Man-Fang; Wuu, D. S. ; Peng, W. C. ; Tsai, S. J. ; Liu, J. S. |
| 國立彰化師範大學 |
2001 |
Wafer Bonding of 50-mm-Diameter Mirror Substrates to AlGaInP Light-Emitting Diode Wafers
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Horng, R. H. ; Wuu, D. S. ; Seieh, C. H. ; Peng, W. C. ; Huang, Man-Fang; Tsai, S. J. ; Liu, J. S. |
| 國立交通大學 |
2014-12-08T15:26:16Z |
Wafer bonding using indium tin oxide intermediate layer for high brightness LEDs
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Liu, PC; Hou, CY; Wu, YCS |
| 國立臺灣海洋大學 |
2009-12 |
Wafer Defect Inspection by Neural Analysis of Region Features
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Chuan-Yu Chang; Chun-Hsi Li; Yung-Chi Chang; MuDer Jeng |
| 國立交通大學 |
2014-12-08T15:09:01Z |
Wafer defect pattern recognition by multi-class support vector machines by using a novel defect cluster index
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Chao, Li-Chang; Tong, Lee-Ing |
顯示項目 918056-918065 / 2348487 (共234849頁)
<< < 91801 91802 91803 91804 91805 91806 91807 91808 91809 91810 > >>
每頁顯示[10|25|50]項目
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