臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
國立交通大學	2014-12-08T15:30:44Z	Copper silicide/silicon nanowire heterostructures: in situ TEM observation of growth behaviors and electron transport properties	Chiu, Chung-Hua; Huang, Chun-Wei; Chen, Jui-Yuan; Huang, Yu-Ting; Hu, Jung-Chih; Chen, Lien-Tai; Hsin, Cheng-Lun; Wu, Wen-Wei
國立臺灣大學	2007	Copper sorption on mesoporous titanium phosphate.	Chiang, P.N.; Chen, T.Y.; Wang, M.K.; Lee, J.F.
國立中山大學	2001	Copper stress in Ulva fasciata	黃雅玲;李澤民
臺大學術典藏	2021-08-05T02:40:46Z	Copper sulfide nano-globules reinforced electrodes for high-performance electrochemical determination of toxic pollutant hydroquinone	Maheshwaran S;Balaji R;Chen S.-M;Biswadeep R;Renganathan V;Narendhar C;Kao C.R.; Maheshwaran S; Balaji R; Chen S.-M; Biswadeep R; Renganathan V; Narendhar C; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2021-08-03T01:43:06Z	Copper sulfide nanoassemblies for catalytic and photoresponsive eradication of bacteria from infected wounds	Nain A;Wei S.-C;Lin Y.-F;Tseng Y.-T;Mandal R.P;Huang Y.-F;Huang C.-C;Tseng F.-G;Chang H.-T.; Nain A; Wei S.-C; Lin Y.-F; Tseng Y.-T; Mandal R.P; Huang Y.-F; Huang C.-C; Tseng F.-G; Chang H.-T.; HUAN-TSUNG CHANG
國立成功大學	2022	Copper sulfides based photocatalysts for degradation of environmental pollution hazards: A review on the recent catalyst design concepts and future perspectives	Sudhaik, A.;Raizada, P.;Rangabhashiyam, S.;Singh, A.;Nguyen, V.-H.;Van, Le Q.;Khan, A.A.P.;Hu, C.;Huang, C.-W.;Ahamad, T.;Singh, P.
國立暨南國際大學	2004	Copper surface protection with a completely enclosed copper structure for a damascene process	劉繼文?; Liu, CW
國立暨南國際大學	2004	Copper surface protection with a completely enclosed copper structure for a damascene process	王英郎?; Wang, YL
國立暨南國際大學	2004	Copper surface protection with a completely enclosed copper structure for a damascene process	吳幼麟?; Wu, YL
國立交通大學	2014-12-08T15:39:43Z	Copper surface protection with a completely enclosed copper structure for a damascene process	Wang, TC; Hsieh, TE; Wang, YL; Wu, YL; Lo, KY; Liu, CW; Chen, KW

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