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Showing items 297481-297505 of 2348570 (93943 Page(s) Totally)
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| 中華大學 |
2000 |
Cu,Ni金屬鍍層光纖銲接強度之研究
|
陳鴻毅; Chen, Huang I |
| 中華大學 |
2003 |
Cu,Ni雙層金屬鍍層光纖焊接強度之研究
|
林育立; Lin, Yuli |
| 中華大學 |
2003 |
Cu,Sn雙層金屬鍍層光纖焊接強度之研究
|
林育立; Lin, Yuli |
| 臺大學術典藏 |
2018-09-10T04:48:16Z |
CU-63 NMR SHIFT AND RELAXATION BEHAVIOR IN TL2BA2CA2CU3O10-DELTA (T(C)=125-K)
|
Han, Z. P.;Dupree, R.;Liu, R. S.;Edwards, P. P.; Han, Z. P.; Dupree, R.; Liu, R. S.; Edwards, P. P.; RU-SHI LIU |
| 國立成功大學 |
2019-05 |
Cu-Al interfacial formation and kinetic growth behavior during HTS reliability test
|
Liu;Chien-Pan;Chang;Shoou-Jinn;Liu;Yen-Fu;Chen;Wei-Shou |
| 臺大學術典藏 |
2020-04-28T07:11:05Z |
Cu-based alloys for 3DP by melt extrusion process
|
AN-BANG WANG; Chou, C.S.; Wei, W.C.J.; Liu, B.H.; Wang, A.B.; Luo, R.C. |
| 臺大學術典藏 |
2020-05-05T08:40:21Z |
Cu-based alloys for 3DP by melt extrusion process
|
Chou C.S.; Wei W.C.J.; Liu B.H.; Wang A.B.; Luo R.C.; AN-BANG WANG |
| 臺大學術典藏 |
2020-05-12T02:54:10Z |
Cu-based alloys for 3DP by melt extrusion process
|
Chou, C.S.; Wei, W.C.J.; Liu, B.H.; Wang, A.B.; Luo, R.C.; WEN-CHENG J. WEI |
| 元智大學 |
2009-11 |
Cu-CePd/Zn應用於氧化甲醇蒸氣重組及其反應機制
|
曾昱嘉; 王榮輝; 沈家傑; 葉君棣 |
| 國立交通大學 |
2014-12-12T02:17:08Z |
Cu-CVD 即時監控系統的製作（I）
|
陳乾文; Chen, Chiang-Weng; 張隆國; Lon-Kou Chang |
| 國立成功大學 |
2021-10-30 |
Cu-doped p-type ZnO nanostructures as unique acetone sensor at room temperature (similar to 25 degrees C)
|
Brahma;Sanjaya;Yeh;Yu-Wen;Huang;Jow-Lay;Liu;Chuan-Pu |
| 國立成功大學 |
2021 |
Cu-doped p-type ZnO nanostructures as unique acetone sensor at room temperature (~25 �C)
|
Brahma, S.;Yeh, Yeh Y.-W.;Huang, J.-L.;Liu, C.-P. |
| 國立臺灣科技大學 |
1994 |
Cu-EDTA錯合物之膠體吸附浮選
|
曾錦興 |
| 國立中山大學 |
2001 |
Cu-III-VI2單接面和串接式薄膜太陽電池研製
|
曾百亨 |
| 國立中山大學 |
2002 |
Cu-III-VI2單接面和串接式薄膜太陽電池研製
|
曾百亨 |
| 國立中山大學 |
2003 |
Cu-III-VI2薄膜太陽電池研製
|
曾百亨 |
| 國立中山大學 |
2004 |
Cu-III-VI2薄膜太陽電池研製(III)
|
曾百亨 |
| 國立中山大學 |
2005 |
Cu-III-VI2薄膜太陽電池研製(Ⅳ)
|
曾百亨 |
| 國立成功大學 |
2017 |
Cu-Induced Dielectric Breakdown of Porous Low-Dielectric-Constant Film
|
Cheng, Y.-L.;Lee, C.-Y.;Huang, Y.-L.;Sun, C.-R.;Lee, W.-H.;Chen, G.-S.;Fang, J.-S.;Phan, B.T. |
| 國立臺灣大學 |
2002 |
Cu-Mediated Syntheses of N-Fused and Ring-Modified Trithiahexaphyrins
|
Hung, Chen-Hsiung; Jong, Jing-Ping; Ho, Mu-Yih; Lee, Gene-Hsiang; Peng, Shie-Ming |
| 臺大學術典藏 |
2018-09-10T04:10:24Z |
Cu-mediated syntheses of N-fused and ring-modified trithiahexaphyrins
|
Hung, C.-H.;Jong, J.-P.;Ho, M.-Y.;Lee, G.-H.;Peng, S.-M.; Hung, C.-H.; Jong, J.-P.; Ho, M.-Y.; Lee, G.-H.; Peng, S.-M.; SHIE-MING PENG |
| 國立交通大學 |
2014-12-16T06:14:29Z |
Cu-metalized compound semiconductor device
|
Chang; Edward Yi; Shang-Wen; Lee; Cheng-Shih |
| 國立交通大學 |
2014-12-16T06:16:10Z |
Cu-metalized compound semiconductor device
|
Chang, Edward Yi; Chang, Shang-Wen; Lee, Cheng-Shih |
| 國立臺灣大學 |
2007-02 |
Cu-Pd-Cu and Cu-Pt-Cu linear frameworks: Synthesis, magnetic properties, and theoretical analysis of two mixed-metal complexes of dipyridylamide (dpa), isostructural, and isoelectronic with [Cu3(dPa)(4)Cl-2](+)
|
Liu, Isiah Po-Chun; Lee, Gene-Hsiang; Peng, Shie-Ming; Benard, Marc; Rohmer, Marie-Madeleine |
| 臺大學術典藏 |
2018-09-10T06:26:27Z |
Cu-Pd-Cu and Cu-Pt-Cu linear frameworks: Synthesis, magnetic properties, and theoretical analysis of two mixed-metal complexes of dipyridylamide (dpa), isostructural, and isoelectronic with [Cu3(dpa)4Cl 2]+
|
Liu, I.P.-C.; Lee, G.-H.; Peng, S.-M.; B{\\'e; SHIE-MING PENG |
Showing items 297481-297505 of 2348570 (93943 Page(s) Totally)
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