臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
國立交通大學	2014-12-08T15:20:51Z	Diffusion Barrier Characteristics of Electroless Co(W,P) Thin Films to Lead-Free SnAgCu Solder	Pan, Hung-Chun; Hsieh, Tsung-Eong
國立成功大學	2008-02	Diffusion barrier layers for Al on GaAs native oxide grown by liquid phase chemical-enhanced oxidation	Huang, Jian-Jiun; Chou, Dei-Wei; Sze, Po-Wen; Wang, Yeong-Her
國立成功大學	2004-12-01	Diffusion barrier of sputtered W film for Cu Schottky contacts on InGaP layer	Lee, Ching-Ting; Liu, Day-Shan; Deng, Ren-Wei
國立成功大學	2005-12-01	Diffusion barrier properties of amorphous ZrCN films for copper metallization	Chen, Cheng-Shi; Liu, Chuan-Pu
國立中山大學	2003	Diffusion barrier properties of metallorganic chemical vapor deposited NbNxOyCz films for Cu metallization	C.W. Wu;W.C. Gau;J.C. Hu;T.C. Chang;L.J. Chen
修平科技大學	2000	Diffusion barrier properties of single- and multilayered quasi-amorphous tantalum nitride thin films against copper penetration	G. S. Chen;S. T. Chen
國立臺灣科技大學	2003	Diffusion Barrier Properties of Sputtered TaNx Between Cu and Si Using TaN as the Target	Yu-Lin Kuo; Jui-Jen Huang; Shun-Tang Lin; Chiapyng Lee; W. H. Lee
國立臺灣科技大學	2002	Diffusion Barrier Properties of Sputtered TaNx Between Cu and Si Using TaN as the Target	郭俞麟;李文鴻;李嘉平
國立臺灣科技大學	2003	Diffusion barrier properties of sputtered TaNx between Cu and Si using TaN as the target	Kuo, Y.L.;Huang, J.J.;Lin, S.T.;Lee, C.;Lee, W.H.
國立成功大學	2000-05	Diffusion barrier properties of sputtered TiB2 between Cu and Si	Chen, Jen-Sue; Wang, J. L.

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