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Showing items 353831-353840 of 2348674 (234868 Page(s) Totally)
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| 義守大學 |
2012-03 |
Effect of Al Nanoparticles on the Microstructure, Electrical, and Optical Properties of AZO/Al/AZO Trilayer Thin Film
|
Yen-Sheng Lin;Wei-Chih Tseng |
| 國立成功大學 |
2005-06-15 |
Effect of Al on the electrochemical corrosion behaviour of Pb free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立東華大學 |
2008 |
Effect of Al substitution on the transport properties of SrSi2
|
Kuo, Y. K. |
| 國立交通大學 |
2014-12-08T15:15:51Z |
Effect of al trace dimension on electromigration failure time of flip-chip solder joints
|
Chiu, S. H.; Chen, Chih; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:12:12Z |
Effect of Al(III) speciation on coagulation of highly turbid water
|
Lin, Jr-Lin; Huang, Chihpin; Pan, Jill Ruhsing; Wang, Dongsheng |
| 國立交通大學 |
2014-12-08T15:14:40Z |
Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
|
Liang, S. W.; Chiu, S. H.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:16:48Z |
Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
|
Liang, SW; Chang, YW; Chen, C |
| 國立交通大學 |
2014-12-08T15:48:13Z |
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
|
Liang, S. W.; Hsiao, H. Y.; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:15Z |
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
|
Liang, S. W.; Hsiao, H. Y.; Chen, Chih |
| 臺大學術典藏 |
2020-06-16T06:32:10Z |
Effect of Al/Cu ratios on the optical, electrical, and electrochemical properties of Cu-Al-Ca-O thin films
|
Cheng, I.-C.;Chang, S.-H.;Lin, G.-W.;Chi, C.-T.;Hsiao, S.-H.;Chen, J.-Z.; Cheng, I.-C.; Chang, S.-H.; Lin, G.-W.; Chi, C.-T.; Hsiao, S.-H.; Chen, J.-Z.; I-CHUN CHENG |
Showing items 353831-353840 of 2348674 (234868 Page(s) Totally)
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