| 國立高雄應用科技大學 |
2009 |
Effect of Crystallinity on Enthalpy Recovery Peaks and
|
Yeong-Tarng Shieh; Yu-Sheng Lin; Yawo-Kuo Twu; Hong-Bing Tsai; Rong-Hsien Lin |
| 國立高雄應用科技大學 |
2010-05 |
Effect of Crystallinity on Enthalpy Recovery Peaks and Cold-crystallization Peaks in PET via TMDSC and DMA Studies
|
林榮顯; Yeong-Tarng Shieh; Yu-Sheng Lin; Rong-Hsien Lin |
| 大葉大學 |
2010-05-5 |
Effect of Crystallinity on Enthalpy Recovery Peaks and Cold-Crystallization Peaks in PET via TMDSC and DMA Studies
|
Shieh, Yeong-Tarng;Lin, Yu-Sheng;Twu, Yawo-Kuo;Tsai, Hong-Bing;Lin, Rong-Hsien |
| 大葉大學 |
2010-05-05 |
Effect of Crystallinity on Enthalpy Recovery Peaks and Cold-Crystallization Peaks in PET via TMDSC and DMA Studies
|
Shieh, Yeong-Tarng;Lin, Yu-Sheng;Twu, Yawo-Kuo;Tsai, Hong-Bing;Lin, Rong-Hsien |
| 國立交通大學 |
2014-12-08T15:37:57Z |
Effect of Crystallinity on the Optical Reflectance of Cylindrical Colloidal Crystals
|
Lai, Chun-Han; Yang, Yu-Lin; Chen, Li-Yin; Huang, Yi-Jui; Chen, Jing-Yu; Wu, Pu-Wei; Cheng, Yu-Ting; Huang, Yang-Tung |
| 國立臺灣海洋大學 |
2008-04-15 |
Effect of crystallization on corrosion behavior of Fe40Ni38B18Mo4 amorphous alloy in 3.5% sodium chloride solution
|
Yun-Fang Wu;Wen-Chi Chiang;Jiann-Kuo Wu |
| 國立成功大學 |
2007-02 |
Effect of crystallization on the bonding strength and failures of plasma-sprayed hydroxyapatite
|
Yang, Chung-Wei; Lui, Truan-Sheng |
| 國立臺灣科技大學 |
2017 |
Effect of crystallographic orientation on single crystal copper nanogrooving behaviors by MD method
|
Lin, Y.-C;Shiu, Y.-C. |
| 國立臺灣科技大學 |
2007 |
Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate
|
Yen, Y.-W.;Liou, W.-K. |
| 元智大學 |
Jun-21 |
Effect of Cu and N co-doping in ZnO crystals through thermal processing on energy-level distribution
|
黃鈺斌; Chau-Kuang Liau |
| 國立聯合大學 |
2010 |
Effect of Cu and Ni doping on the structure and magnetic properties of FePt nanoparticles
|
S. W. Yung, J. S. Lin and S. P. Ju |
| 國立臺灣大學 |
2002-02 |
Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
|
Chen, W. T.; Ho, C. E.; Kao, and C. R. |
| 國立臺灣大學 |
2002-06 |
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
|
Ho, C. E.; Tsai, R. Y.; Lin, Y. L.; Kao, and C. R. |
| 國立臺灣大學 |
2010 |
Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni
|
Yang, S.C.; Chang, C.C.; Tsai, M.H.; Kao, C.R. |
| 臺大學術典藏 |
2020-04-28T07:11:48Z |
Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni
|
Tsai, M. H.; Kao, C. R.; CHIEN-CHENG CHANG; Chang, C. C.; Yang, S. C. |
| 淡江大學 |
2003 |
Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization
|
Hsu, S. C.; Wang, S. J.; Liu, C. Y. |
| 國立成功大學 |
2022-10 |
Effect of Cu Intercalation Layer on the Enhancement of Spin-to-Charge Conversion in Py/Cu/Bi2Se3
|
Su;Hsuan, Shu;Chong;Cheong-Wei;Lee;Jung-Chuan;Chen;Yi-Chun;Marchenkov;Viktorovich, Vyacheslav;Huang;Andrew, Jung-Chun |
| 元智大學 |
2019/11/15 |
Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz
|
W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho |
| 元智大學 |
2019/11/15 |
Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz
|
W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho |
| 國立高雄大學 |
2010-07 |
Effect of Cu species on leaching behavior of simulated copper sludge after thermal treatment: ESCA analysis
|
Chou, Jing-Dong; Lin, Chiou-Liang; Wey, Ming-Yen; Chang, Shih-Hsien |
| 中山醫學大學 |
2010-07 |
Effect of Cu species on leaching behavior of simulated copper sludge after thermal treatment: ESCA analysis.
|
Chou JD;Lin CL;Wey MY;Chang SH |
| 國立交通大學 |
2014-12-08T15:07:51Z |
Effect of Cu-Ion Concentration in Concentrated H(3)PO(4) Electrolyte on Cu Electrochemical Mechanical Planarization
|
Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T05:58:26Z |
Effect of Cu-Ion Concentration in Concentrated H3PO4 Electrolyte on Cu Electrochemical Mechanical Planarization
|
Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立聯合大學 |
2010 |
Effect of Cu2O-doped TiO2Films as Working Electrode for Dye-sensitized Solar Cells
|
Chien-Chung Hsu, Chuan-Jung Lin, Wei-Yuen Tseng, Fu-Tsai Hwang, Kuan-Chen Ting |
| 中國文化大學 |
2008 |
Effect of cultivation conditions on spore production from Bacillus amyloliquefaciens B128 and its antagonism to Botrytis elliptica
|
Tzeng, Y. -M.; Rao, Y. K.; Tsay, K. -J.; Wu, W. -S. |
