臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
淡江大學	2003	Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization	Hsu, S. C.; Wang, S. J.; Liu, C. Y.
國立成功大學	2022-10	Effect of Cu Intercalation Layer on the Enhancement of Spin-to-Charge Conversion in Py/Cu/Bi2Se3	Su;Hsuan, Shu;Chong;Cheong-Wei;Lee;Jung-Chuan;Chen;Yi-Chun;Marchenkov;Viktorovich, Vyacheslav;Huang;Andrew, Jung-Chun
元智大學	2019/11/15	Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz	W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/11/15	Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz	W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho
國立高雄大學	2010-07	Effect of Cu species on leaching behavior of simulated copper sludge after thermal treatment: ESCA analysis	Chou, Jing-Dong; Lin, Chiou-Liang; Wey, Ming-Yen; Chang, Shih-Hsien
中山醫學大學	2010-07	Effect of Cu species on leaching behavior of simulated copper sludge after thermal treatment: ESCA analysis.	Chou JD;Lin CL;Wey MY;Chang SH
國立交通大學	2014-12-08T15:07:51Z	Effect of Cu-Ion Concentration in Concentrated H(3)PO(4) Electrolyte on Cu Electrochemical Mechanical Planarization	Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang
國立交通大學	2019-04-02T05:58:26Z	Effect of Cu-Ion Concentration in Concentrated H3PO4 Electrolyte on Cu Electrochemical Mechanical Planarization	Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang
國立聯合大學	2010	Effect of Cu2O-doped TiO2Films as Working Electrode for Dye-sensitized Solar Cells	Chien-Chung Hsu, Chuan-Jung Lin, Wei-Yuen Tseng, Fu-Tsai Hwang, Kuan-Chen Ting
中國文化大學	2008	Effect of cultivation conditions on spore production from Bacillus amyloliquefaciens B128 and its antagonism to Botrytis elliptica	Tzeng, Y. -M.; Rao, Y. K.; Tsay, K. -J.; Wu, W. -S.

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