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Showing items 355336-355345 of 2348719 (234872 Page(s) Totally) << < 35529 35530 35531 35532 35533 35534 35535 35536 35537 35538 > >> View [10|25|50] records per page
| 臺大學術典藏 |
2019-12-24T09:05:42Z |
Effect of de novo transcriptome assembly on transcript quantification
|
Hsieh P.-H.;Oyang Y.-J.;Chen C.-Y.; Hsieh P.-H.; Oyang Y.-J.; Chen C.-Y.; CHIEN-YU CHEN |
| 臺大學術典藏 |
2019 |
Effect of de novo transcriptome assembly on transcript quantification
|
YEN-JEN OYANG; Chen, C.-Y.; Oyang, Y.-J.; Hsieh, P.-H.; Hsieh, P.-H.;Oyang, Y.-J.;Chen, C.-Y. |
| 臺大學術典藏 |
2022-03-22T08:28:36Z |
Effect of Dealloying Time and Post-Annealing on the Surface Morphology and Electrocatalytic Behavior of Nanoporous Copper Films for CO2Reduction Reaction
|
Zeng W.-Y;Lai J.-H;Cheng I.-C.; Zeng W.-Y; Lai J.-H; Cheng I.-C.; I-Chung Cheng |
| 臺大學術典藏 |
2022-03-22T08:28:36Z |
Effect of Dealloying Time and Post-Annealing on the Surface Morphology and Electrocatalytic Behavior of Nanoporous Copper Films for CO2Reduction Reaction
|
Zeng W.-Y;Lai J.-H;Cheng I.-C.; Zeng W.-Y; Lai J.-H; Cheng I.-C.; I-Chung Cheng |
| 臺大學術典藏 |
2022-03-22T08:25:50Z |
Effect of Dealloying Time and Post-Annealing on the Surface Morphology and Electrocatalytic Behavior of Nanoporous Copper Films for CO2Reduction Reaction
|
Zeng W.-Y;Lai J.-H;Cheng I.-C.; Zeng W.-Y; Lai J.-H; Cheng I.-C.; I-Chung Cheng |
| 臺大學術典藏 |
2022-01-22T00:04:49Z |
Effect of Dealloying Time and Post-Annealing on the Surface Morphology and Electrocatalytic Behavior of Nanoporous Copper Films for CO2Reduction Reaction
|
Zeng, Wang You; Lai, Jia Hao; I-Chung Cheng |
| 國立成功大學 |
2015-04 |
Effect of Decision Load on Whole-Display Superiority in Change Detection
|
Yang, Cheng-Ta; Tseng, Philip; Wu, Yi-Jung |
| 臺大學術典藏 |
2018-09-10T06:48:06Z |
Effect of decisions to withhold life support on prolonged survival
|
Chen, Y.-Y. and Connors Jr., A.F. and Garland, A.; Chen, Yen-Yuan |
| 臺大學術典藏 |
2019-12-25T08:08:26Z |
Effect of decisions to withhold life support on prolonged survival
|
YEN-YUAN CHEN; Connors Jr. A.F.; Garland A. |
| 臺大學術典藏 |
2020-01-06T03:11:54Z |
Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions
|
Yong, Y.; Nguyen, M.T.; Tsukamoto, H.; Matsubara, M.; Liao, Y.-C.; Yonezawa, T.; YING-CHIH LIAO |
Showing items 355336-355345 of 2348719 (234872 Page(s) Totally) << < 35529 35530 35531 35532 35533 35534 35535 35536 35537 35538 > >> View [10|25|50] records per page
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