| 臺大學術典藏 |
2008-12-10T02:02:04Z |
Electrical interaction between two spherical particles covered by an ion-penetrable charged membrane
|
Liu, Bo-Tau; Hsu, Jyh-Ping; Hsu, Jyh-Ping; Liu, Bo-Tau |
| 國立臺灣大學 |
1998 |
Electrical interaction between two spherical particles covered by an ion-penetrable charged membrane
|
Hsu, Jyh-Ping; Liu, Bo-Tau |
| 臺大學術典藏 |
1999 |
Electrical Interaction Energy between Two Charged Entities in an Electrolyte Solution
|
Hsu, Jyh-Ping; Liu, Bo-Tau; Hsu, Jyh-Ping; Liu, Bo-Tau |
| 國立臺灣大學 |
1999 |
Electrical Interaction Energy between Two Charged Entities in an Electrolyte Solution
|
Hsu, Jyh-Ping; Liu, Bo-Tau |
| 國立臺灣科技大學 |
2015 |
Electrical interconnect test method of 3D ICs by injected charge volume
|
Suga, D.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2015 |
Electrical interconnect test method of 3D ICs without boundary scan flip flops
|
Hashizume, M;Umezu, S;Ikiri, Y;Ali, F.A.B;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2015 |
Electrical interconnect test of 3D ICs made of dies without ESD protection circuits with a built-in test circuit
|
Nanbara, K.;Odoriba, A.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
Electrical interconnect test of solder joint part with boundary scan flip flops and a built-in test circuit
|
Hashizume, M;Ikiri, Y;Konishi, T;Yotsuyanagi, H;Lu, S.-K. |
| 國立交通大學 |
2014-12-08T15:35:46Z |
Electrical Investigation and Reliability of 3D Integration Platform using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid Bonding
|
Chang, Yao-Jen; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chiang, Cheng-Hao; Fu, Huan-Chun; Yu, Tsung-Han; Fan, Cheng-Han; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:49Z |
Electrical Investigation of Cu Pumping in Through-Silicon Vias for BEOL Reliability in 3D Integration
|
Cheng, Chuan-An; Sugie, Ryuichi; Uchida, Tomoyuki; Chen, Kou-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng |
| 臺大學術典藏 |
2020-04-28T07:11:14Z |
Electrical isolation and characteristics of permanent magnet-actuated valves for PDMS microfluidics
|
Chen, C.-Y.; Chen, C.-H.; Tu, T.-Y.; Lin, C.-M.; Wo, A.M.; ANDREW WO |
| 元培科技大學 |
2004 |
Electrical Lumped Model for Arterial Vessel Beds,
|
Lee; Tsung-Chieh; Huang; Ke-Feng; Hsiao; Ming-Liang; Tang; Shih-Tsang and Young; Sheunn-Tsong |
| 國立臺灣大學 |
2008-07 |
Electrical manipulation of magnetic anisotropy in the composite of liquid crystals and ferromagnetic nanorods
|
Lin, T.-J.; Chen, Y.-F.; Chen, C.-C.; Lee, W.C.; Cheng, S. |
| 臺大學術典藏 |
2018-09-10T06:55:54Z |
Electrical manipulation of magnetic anisotropy in the composite of liquid crystals and ferromagnetic nanorods
|
Lin, T.-J.; Chen, Y.-F.; Chen, C.-C.; Lee, W.C.; Cheng, S.; Lin, T.-J.; Chen, Y.-F.; Chen, C.-C.; Lee, W.C.; Cheng, S.Lin, T.-J.; Chen, C.-C.; Lee, W.; Cheng, S.; Chen, Y.-F.; SOO-FIN CHENG; YANG-FANG CHEN |
| 國立交通大學 |
2014-12-08T15:12:30Z |
Electrical measurement of local stress and lateral diffusion near Source/Drain extension corner of uniaxially stressed n-MOSFETs
|
Hsieh, Chen-Yu; Chen, Ming-Jer |
| 國立交通大學 |
2014-12-08T15:24:41Z |
Electrical measurements on iridium dioxide nanorods
|
Lin, Y. H.; Lee, T. C.; Lin, J. J.; Chang, H. M.; Huang, Y. S. |
| 國立臺灣科技大學 |
2006 |
Electrical measurements on iridium dioxide nanorods
|
Lin Y.H.; Lee T.C.; Lin J.J.; Chang H.M.; Huang Y.S. |
| 臺大學術典藏 |
2022-03-22T15:04:55Z |
Electrical Measurements to Detect Liquid Concentration
|
Yeh, Chun Hung; Lee, Cheng Tse; Chiu, Jih Chao; Wu, Yi Ting; CHIH-TING LIN; Yu, Chwen; Chuang, Tzu Sou; CHEN-WUING LIU |
| 義守大學 |
2006-12 |
Electrical Modeling and Circuit Simulation for SI Analysis of High-Speed FC-BGA
|
Ming-Kun Chen;Yu-Jung Huang;Shu-Jung Hou;Yu-Hung Chen;Chien-Kai Yang;Shen-Li Fu |
| 國立中山大學 |
2007-10 |
Electrical modeling and design issues for full wireless system in package
|
T.S. Horng |
| 義守大學 |
2017-10 |
Electrical modeling of 3D stacked TSV
|
Zhi-Min Zhang;Shin-Chun Lin;Chung-Long Pan;Yu-Jung Huang |
| 國立中山大學 |
1999 |
Electrical modeling of enhanced ball grid array packages using coupled transmission lines
|
T.S. Horng;S.M. Wu;A. Tseng;H.H. Huang |
| 國立中山大學 |
1999-09 |
Electrical modeling of enhanced ball grid array packages using coupled transmission lines
|
T.S. Horng;S.M. Wu; A. Tseng; H.H. Huang |
| 國立中山大學 |
1999 |
Electrical modeling of RFIC packages up to 12 GHz
|
T.S. Horng;S.M. Wu;C. Shih |
| 國立交通大學 |
2014-12-08T15:33:01Z |
Electrical Modulation of the Local Conduction at Oxide Tubular Interfaces
|
Hsieh, Ying-Hui; Strelcov, Evgheni; Liou, Jia-Ming; Shen, Chia-Ying; Chen, Yi-Chun; Kalinin, Sergei V.; Chu, Ying-Hao |
