| 臺大學術典藏 |
2022-03-22T15:04:55Z |
Electrical Measurements to Detect Liquid Concentration
|
Yeh, Chun Hung; Lee, Cheng Tse; Chiu, Jih Chao; Wu, Yi Ting; CHIH-TING LIN; Yu, Chwen; Chuang, Tzu Sou; CHEN-WUING LIU |
| 義守大學 |
2006-12 |
Electrical Modeling and Circuit Simulation for SI Analysis of High-Speed FC-BGA
|
Ming-Kun Chen;Yu-Jung Huang;Shu-Jung Hou;Yu-Hung Chen;Chien-Kai Yang;Shen-Li Fu |
| 國立中山大學 |
2007-10 |
Electrical modeling and design issues for full wireless system in package
|
T.S. Horng |
| 義守大學 |
2017-10 |
Electrical modeling of 3D stacked TSV
|
Zhi-Min Zhang;Shin-Chun Lin;Chung-Long Pan;Yu-Jung Huang |
| 國立中山大學 |
1999 |
Electrical modeling of enhanced ball grid array packages using coupled transmission lines
|
T.S. Horng;S.M. Wu;A. Tseng;H.H. Huang |
| 國立中山大學 |
1999-09 |
Electrical modeling of enhanced ball grid array packages using coupled transmission lines
|
T.S. Horng;S.M. Wu; A. Tseng; H.H. Huang |
| 國立中山大學 |
1999 |
Electrical modeling of RFIC packages up to 12 GHz
|
T.S. Horng;S.M. Wu;C. Shih |
| 國立交通大學 |
2014-12-08T15:33:01Z |
Electrical Modulation of the Local Conduction at Oxide Tubular Interfaces
|
Hsieh, Ying-Hui; Strelcov, Evgheni; Liou, Jia-Ming; Shen, Chia-Ying; Chen, Yi-Chun; Kalinin, Sergei V.; Chu, Ying-Hao |
| 國立成功大學 |
2013-10 |
Electrical Modulation of the Local Conduction at Oxide Tubular Interfaces
|
Hsieh, Ying-Hui; Strelcov, Evgheni; Liou, Jia-Ming; Shen, Chia-Ying; Chen, Yi-Chun; Kalinin, Sergei V.; Chu, Ying-Hao |
| 淡江大學 |
2010-10 |
Electrical Network Frequency as a Tool for Audio Concealment Process
|
Chang, Feng-Cheng; Huang, Hsiang-Cheh |
| 國立交通大學 |
2017-04-21T06:48:29Z |
Electrical performance and photo-responses enhancement by in situ nitrogen incorporation to amorphous InGaZnO thin-film transistors
|
Teng, Li-Feng; Liu, Po-Tsun; Fuh, Chur-Shyang; Chou, Yi-Teh; Li, Fu-Hai; Chang, Chih-Hsiang; Shieh, Han-Ping D. |
| 國立臺灣科技大學 |
2018 |
Electrical performance and reliability improvement of amorphous-indium-gallium-zinc-oxide thin-film transistors with HfO2 gate dielectrics by CF4 plasma treatment
|
Fan C.-L.; Tseng F.-P.; Tseng C.-Y. |
| 國立交通大學 |
2014-12-08T15:32:19Z |
Electrical Performance and Reliability Investigation of Cosputtered Cu/Ti Bonded Interconnects
|
Chen, Hsiao-Yu; Hsu, Sheng-Yao; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:10Z |
Electrical performance and stability of tungsten indium zinc oxide thin-film transistors
|
Chauhan, Ram Narayan; Tiwari, Nidhi; Shieh, Han-Ping D.; Liu, Po-Tsun |
| 國立交通大學 |
2014-12-08T15:11:55Z |
Electrical performance and thermal stability of MIC poly-Si TFTs improved using drive-in nickel induced crystallization
|
Lai, Ming-Hui; Wu, Yew Chung Sermon; Chang, Chih-Pang |
| 國立交通大學 |
2014-12-08T15:32:31Z |
Electrical Performance Enhancement of AlZn-SnO Thin Film Transistor by Supercritical Fluid Treatment
|
Teng, Li-Feng; Liu, Po-Tsun; Wang, Wei-Ya |
| 國立中山大學 |
2001 |
Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard thin shrink small outline packages
|
T.S. Horng;S.M. Wu;C.T. Chiu;C.P. Hung |
| 國立中山大學 |
2001-11 |
Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard thin shrink small outline packages
|
T.S. Horng; S.M. Wu;C.T. Chiu; C.P. Hung |
| 國立彰化師範大學 |
2012-03 |
Electrical Performance of Micro-assembled Beads under Different Temperatures and Loadings
|
Tzeng, Yen-Lin; Wang, Kerwin |
| 國立臺灣科技大學 |
2012 |
Electrical performance of the embedded-type surface electrodes containing carbon and silver nanowires as fillers and one-step organosoluble polyimide as a matrix
|
Lin, C.-Y.;Kuo, D.-H.;Chen, W.-C.;Ma, M.-W.;Liou, G.-S. |
| 臺大學術典藏 |
2018-09-10T09:17:03Z |
Electrical performance of the embedded-type surface electrodes containing carbon and silver nanowires as fillers and one-step organosoluble polyimide as a matrix
|
Lin, C.-Y.; Kuo, D.-H.; Chen, W.-C.; Ma, M.-W.; Liou, G.-S.; GUEY-SHENG LIOU |
| 國立中山大學 |
2000-05 |
Electrical performance on RFICs using bump chip carrier packages as compared to standard small outline packages
|
T.S. Horng;S.M. Wu;J.Y. Li;C.T. Chiu;C.P. Hung |
| 國立交通大學 |
2014-12-08T15:28:41Z |
Electrical Performances and Quality Investigations of Integrated Bonded Structures and TSVs for 3D Interconnects
|
Chen, K. N.; Chang, Y. J.; Ko, C. T.; Hsu, S. Y.; Chen, H. Y.; Hsiao, C.; Yu, T. H.; Chen, Y. H.; Lo, W. C. |
| 國立交通大學 |
2014-12-08T15:33:11Z |
Electrical Performances and Structural Designs of Copper Bonding in Wafer-Level Three-Dimensional Integration
|
Chen, K. N.; Young, A. M.; Lee, S. H.; Lu, J. -Q. |
| 國立交通大學 |
2019-06-03T01:08:34Z |
Electrical polarization induced by atomically engineered compositional gradient in complex oxide solid solution
|
Wu, Ping-Chun; Huang, Rong; Hsieh, Ying-Hui; Wang, Bo; Yen, Min; Ho, Sheng-Zhu; Kumamoto, Akihito; Zhong, Chaorong; Song, Haili; Chen, Yi-Chun; Chen, Long-Qing; Duan, Chun-Gang; Ikuhara, Yuichi; Chu, Ying-Hao |
