| 國立臺灣大學 |
2004 |
Heat Capacity Changes Accompanying Micelle Formation upon Burial of Hydrophobic Tail of Nonionic Surfactants
|
Chen, Li-Jen; Sheu, Yih-Heh; Li, Pei-Juian |
| 國立成功大學 |
2017 |
Heat capacity jumps induced by magnetic field in the Er2HoAl5O12 garnet
|
Shevchenko, E.V.;Charnaya, E.V.;Lee, M.K.;Chang, L.J.;Khazanov, E.N.;Taranov, A.V.;Bugaev, A.S. |
| 臺大學術典藏 |
2020-05-12T02:53:40Z |
Heat capacity of Al2O3-NiAl composites, a key parameter for thermal management
|
Hsu, H.-C.; Yeh, C.-T.; Tuan, W.-H.; WEI-HSING TUAN |
| 中原大學 |
1999 |
Heat Capacity of Alkanolamine Aqueous Solutions
|
Li-Feng Chiu;Meng-Hui Li |
| 中原大學 |
1999 |
Heat Capacity of Alkanolamines by Differential Scanning Calorimetry
|
Li-Feng Chiu;Hsiao-Fen Liu;Meng-Hui Li |
| 中原大學 |
2002 |
Heat Capacity of Aqueous Mixtures of Diethanolamine with 2-amino-2-methyl-l-propanol
|
Tzn-Wei Shih;Meng-Hui Li |
| 中原大學 |
2001-01 |
Heat Capacity of Aqueous Mixtures of Monoethanolamine with 2-Amino-2-methyl-1-propanol
|
Yan-Jen Chen;Meng-Hui Li |
| 中原大學 |
2002 |
Heat Capacity of Aqueous Mixtures of Monoethanolamine with 2-piperidineethanol
|
Tzn-Wei Shih;Yan-Jen Chen;Meng-Hui Li |
| 中原大學 |
2001-01 |
Heat Capacity of Aqueous Mixtures of Monoethanolamine with N-Methyldiethanolamine
|
Yan-Jen Chen;Tzn-Wei Shih;Meng-Hui Li |
| 國立臺灣大學 |
1990 |
Heat Capacity of Polypropylene Composite at High Pressure and Temperature
|
謝國煌; Wang, Y. Z.; Hsieh, Kuo-Huang; Wang, Y. Z. |
| 國立臺灣大學 |
1991-01 |
Heat Capacity of Single-Crystal La2CuO4 and Polycrystalline La2-xSrxCuO4 (0 ? x ? 0.20) from 110 to 600 K
|
Sun, K.; Cho, J. H.; Chou, F. C.; Miller, L. L.; Johnston, D. C.; Hidaka, Y.; Murakami, T. |
| 臺大學術典藏 |
1991 |
Heat capacity of single-crystal La2CuO4 and polycrystalline La2-xSrxCuO4 (0 x 0.20) from 110 to 600 K
|
Chou, F. C.; Lee, W. C.; Miller, L. L.; Johnston, D. C.; Hidaka, Y.; Murakami, T.; Cho, J. H.; Sun, K. |
| 國立交通大學 |
2017-03-02 |
HEAT CONDUCTING MODULE
|
Kuo-Wei LIN; Chi-Chuan WANG |
| 國立成功大學 |
2013-07-15 |
Heat Conduction Analysis in an Anisotropic Thin Film Irradiated by an Ultrafast Pulse Laser Heating
|
Tsai, Tsung-Wen; Lee, Yung-Ming; Shiah, Yui-Chuin |
| 臺大學術典藏 |
2018-09-10T09:45:12Z |
Heat conduction analysis of nonhomogeneous functionally graded three-layer media
|
Ma, C.-C.; Chen, Y.-T.; CHIEN-CHING MA |
| 國立成功大學 |
2003-09 |
Heat conduction in a cylindrically anisotropic tube of a functionally graded material
|
Tarn, Jiann-Quo; Wang, Yung-Ming |
| 國立成功大學 |
2013-12 |
Heat conduction in a functionally graded medium with an arbitrarily oriented crack
|
Chiu, Tz-Cheng; Tsai, Shang-Wu; Chue, Ching-Hwei |
| 國立成功大學 |
2014-02 |
Heat Conduction in Functionally Graded Circular Hollow Cylinders with General Time-dependent Boundary Conditions
|
Lee, Sen Yung; Huang, Chih Cheng |
| 朝陽科技大學 |
2023-06-01 |
Heat Conductivity Test of Carbon Fiber Sandwich Panel with Flame-Retardant Core
|
顏安呈; Yen, An Cheng |
| 臺大學術典藏 |
2018-09-10T09:50:20Z |
Heat dissipation analysis and design of a board-level phased-array transmitter module for 60-GHz Communication
|
RUEY-BEEI WU; HSIN-CHIA LU; R.-B. Wu; H.-C. Cheng;W.-R. Ciou;W.-H. Chen;J.-L. Kuo;H.-C. Lu;R.-B. Wu; H.-C. Cheng; W.-R. Ciou; W.-H. Chen; J.-L. Kuo; H.-C. Lu |
| 國立成功大學 |
2017 |
Heat dissipation analysis of continuously-moving plate undergoing thermal processing using Laplace Adomian decomposition method
|
Chen, Chen C.K.;Chang, Y.-S.;Liu, C.-C.;Chen, B.-S. |
| 國立臺灣科技大學 |
2012 |
Heat dissipation analysis of high power multi-chip cob package leds
|
Wu, H.-H.;Lin, K.-H.;Lin, S.-T. |
| 國立臺灣科技大學 |
2014 |
Heat dissipation capacity of heat sink assembly with/without vortex generators
|
Lin S.-C., Chang C.-J., Wang F.-Y., Hsiao H.-C., Yang S.-K., Hsiao C.-Y. |
| 臺大學術典藏 |
2018-09-10T09:22:35Z |
Heat dissipation consideration of high-power mid-infrared quantum cascade laser arrays
|
Chen, X.; Cheng, L.; Guo, D.; Li, J.-Y.; Choa, F.-S.; JIUN-YUN LI |
| 元智大學 |
2015-10-21 |
Heat Dissipation Improvement Design For QSFP Connector
|
Ming-Chun Hsu; Hungwen Lin |
