| 國立交通大學 |
2014-12-08T15:08:14Z |
Interfacial layer dependence on device property of high-kappa TiLaO Ge/Si N-type metal-oxide-semiconductor capacitors at small equivalent-oxide thickness
|
Chen, W. B.; Chin, Albert |
| 國立交通大學 |
2019-04-02T06:04:16Z |
Interfacial Layer Engineering for Ge MOSFET by Metal Element Doping and Characterization of Interface Density
|
Chien, Chao-Hsin |
| 臺大學術典藏 |
2018-09-10T09:48:16Z |
Interfacial layer reduction and high permittivity tetragonal ZrO 2 on germanium reaching ultrathin 0.39 nm equivalent oxide thickness
|
CHEE-WEE LIU; Liu, C.W.; Hu, C.; Luo, S.-J.; Wong, I.-H.; Chang, H.-C.; Lin, C.-M.; Lin, C.-M.;Chang, H.-C.;Wong, I.-H.;Luo, S.-J.;Liu, C.W.;Hu, C. |
| 國立交通大學 |
2014-12-08T15:06:28Z |
INTERFACIAL LAYER THEORY OF THE SCHOTTKY-BARRIER DIODES
|
WU, CY |
| 臺大學術典藏 |
2018-09-10T09:22:34Z |
Interfacial layer-free ZrO2 on Ge with 0.39-nm EOT, κ?43, ?2×10-3 A/cm2 gate leakage, SS =85 mV/dec, Ion/Ioff =6×105, and high strain response
|
Chang, H.-C.; Chen, Y.-T.; Wong, I.-H.; Lan, H.-S.; Luo, S.-J.; Lin, J.-Y.; Tseng, Y.-J.; Liu, C.W.; Hu, C.; Yang, F.-L.; Lin, C.-M.; CHEE-WEE LIU et al. |
| 國立交通大學 |
2014-12-08T15:06:24Z |
INTERFACIAL LAYER-THERMIONIC-DIFFUSION THEORY FOR THE SCHOTTKY-BARRIER DIODE
|
WU, CY |
| 臺大學術典藏 |
2021-12-10T08:36:46Z |
Interfacial Layering and Screening Behavior of Glyme-Based Lithium Electrolytes
|
Nojabaee, M; Cheng, HW; Valtiner, M; Popovic, J; Maier, J; HSIU-WEI CHENG |
| 國立成功大學 |
2021 |
Interfacial magnetic coupling in Co/antiferromagnetic van der Waals compound FePS3
|
Dhanarajgopal, A.;Chang, P.-C.;Liu, S.-Y.;Chuang, T.-H.;Wei, D.-H.;Kuo, C.-C.;Kuo, C.-N.;Lue, C.S.;Lin, W.-C. |
| 臺大學術典藏 |
2020-03-31T08:24:54Z |
Interfacial magnetic coupling in hetero-structure of Fe/double-perovskite NdBaMn2O6 single crystal
|
Lin, W. C.; Tsai, C. L.; Ogawa, K.; Yamada, S.; Gandhi, A. C.; Lin, J. G. |
| 元智大學 |
2003-11 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
| 元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
| 元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
| 元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
| 國立交通大學 |
2014-12-08T15:42:26Z |
Interfacial mechanism studies of electroless plated Cu films on a-Ta : N layers catalyzed by PIII
|
Lin, JH; Lee, TL; Hsieh, WJ; Lin, CC; Kou, CS; Shih, HC |
| 臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 國立交通大學 |
2014-12-08T15:37:18Z |
Interfacial microstructure and electrical properties of PT/Al2O3/Si annealed at high temperatures
|
Chen, SY; Hsiao, CS; Hsu, JJ |
| 元智大學 |
Sep-18 |
Interfacial Microstructure and Mechanical Reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) Reactive System: P Content Effects
|
Ying-Syuan Wu; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo; Cheng-En Ho |
| 國立成功大學 |
2006-09-28 |
Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2011-04-29 |
Interfacial Microstructure Evolution of (B, Al)N Films Grown on Diamond Substrates
|
Song, Jen-Hao; Huang, Jow-Lay; Sung, James C.; Wang, Sheng-Chang; Lu, Horng-Hwa; Lii, Ding-Fwu |
| 淡江大學 |
2024-12-25 |
Interfacial microstructure in the reaction between BiIn solder and Cu substrate
|
Wang, Yi-wun;Lin, Tzu-yi;Tsai, Cheng-ting |
| 國立中山大學 |
2002 |
Interfacial Microstructure of Pb-Free and Pb-Sn Solder Balls in the Ball-Grid Array Package
|
Chin-Su Chi;Hen-So Chang;Ker-Chang Hsieh;C.L. Chung |
| 元智大學 |
Aug-16 |
Interfacial Microstructures and Mechanical Properties of Molten Sn Reacting with Ni-xP Films
|
Wan-Zhen Hsieh; Md. Arifur Rahman; Tsung-Hsun Yang; Tsai-Tung Kuo; Cheng-En Ho |
| 國立聯合大學 |
2008 |
Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-1Al Pb-free solder pastes on OSP finished printed circuit boards
|
Ching-Tsung Lin, Chi-Shiung Hsi, Moo-Chin Wang, Tao-Chih Chang and Ming-Kann Liang |
