臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
國立交通大學	2014-12-08T15:17:35Z	Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow	Chen, Hsiao-Yun; Chen, Chih
國立臺灣大學	2002	Interfacial Reaction between Liquid Sn-20In-2.8Ag Solder and Ag Substrate	Chiang, M. J.; Chuang, T. H.
臺大學術典藏	2020-05-12T02:53:18Z	Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate	Chiang, M.J.; Chuang, T.H.; TUNG-HAN CHUANG
國立成功大學	2014-05	Interfacial Reaction Between Low-Temperature Co-fired Ceramics and NiCuZn Ferrites in Multilayer Composites	Hsiang, Hsing-I; Lyu, Bing Jyun; Mei, Li-Then; Hsi, Chi-Shiung
國立臺灣科技大學	2019	Interfacial reaction between sn and cu-ti alloy (C1990hp)	Laksono, A.D.;Chang, J.-S.;Yan, J.;Yen, Yen Y.-W.
國立交通大學	2014-12-08T15:09:47Z	Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction	Lin, K. S.; Huang, H. Y.; Chou, C. P.
國立成功大學	2019	Interfacial reaction between YSZ electrolyte and La 0.7 Sr 0.3 VO 3 perovskite anode for application	Liu, C.-Y.;Tsai, S.-Y.;Ni, C.-T.;Fung, K.-Z.
國立成功大學	2019-03	Interfacial reaction between YSZ electrolyte and La0.7Sr0.3VO3 perovskite anode for application	Liu;Chi-Yang;Tsai;Shu-Yi;Ni;Chung-Ta;Fung;Kuan-Zong
國立中山大學	1992	Interfacial Reaction Characterization in Aluminum Base Composites	Y.S. Lo;J.C. Huang
國立臺灣大學	2007	Interfacial reaction issues for lead-free electronic solders	Ho, C. E.; Yang, S. C.; Kao, C. R.

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