| 臺大學術典藏 |
2021-08-05T02:37:56Z |
Transient supercooling performance of thermoelectric coolers with a continuous double current pulse
|
Wang S.-L;Liu H.-B;Gao Y.-W;Shen Y;Yang Y.-R;Wang X.-D;Lee D.-J.; Wang S.-L; Liu H.-B; Gao Y.-W; Shen Y; Yang Y.-R; Wang X.-D; Lee D.-J.; DUU-JONG LEE |
| 臺北醫學大學 |
2003 |
Transient Synovitis of hip: Case Report
|
謝銘勳; Lin YH; Hsieh MS; Ho HC; Chou DT; Chen JK; |
| 南亞技術學院 |
2010/08/20 |
TRANSIENT TEMPERATRE ANALYSIS OF A CYLINDERIAL FIN
|
郭家全 |
| 南亞技術學院 |
2010/08/20 |
TRANSIENT TEMPERATRE ANALYSIS OF A CYLINDERIAL FIN
|
孔光源 |
| 國立臺灣科技大學 |
2009 |
Transient temperature analysis of a cylindrical heat equation
|
Chiang K.-T.; Kuo G.C.; Wang K.-J.; Hsiao Y.F.; Kung K.-Y. |
| 國立臺灣科技大學 |
2005 |
Transient temperature control of the hydrodealkylation reactor
|
King, C.Y.;Yang, W.H.;Chou, Y.S. |
| 國立高雄應用科技大學 |
1973-05 |
Transient Temperature of a Heat Pipe
|
夏漢民; 黃健生; Han M Hsia; Jeng-Sheng Huang |
| 國立臺灣科技大學 |
2012 |
Transient temperature solutions of a cylindrical fin with lateral heat loss
|
Wang, P.-Y.;Kuo, G.-C.;Hu, Y.-H.;Liaw, W.-L.;Chen, Y.;Wang, K.-J.;Kung, K.-Y. |
| 國立成功大學 |
2006-09 |
Transient thermal analysis for board-level chip-scale packages subjected to coupled power and thermal cycling test conditions
|
Wang, Tong-Hong; Lee, Chang-Chi; Lai, Yi-Shao; Lin, Yu-Cheng |
| 朝陽科技大學 |
2021-06 |
Transient thermal analysis of layered media based on thermal quadrupoles
|
江支弘; Chiang, Chih-Hung;Tao, Hung-Yu;Lin, Yung-Chiang |
| 朝陽科技大學 |
2021-03 |
Transient thermal analysis of layered media based on thermal quadrupoles
|
江支弘 |
| 國立中山大學 |
1989 |
Transient Thermal Analysis of the Waterlines Effect in the Die Casting Dies
|
S.S. Hsieh |
| 國立彰化師範大學 |
2007 |
Transient Thermal Annealing Effect on Patterned CoFeB-based Magnetic Tunneling Junction
|
Wu, K. M. ; Huang, C. H. ; Wu, Jong-Ching; Horng, Lance |
| 臺大學術典藏 |
2021-10-07T08:46:21Z |
Transient Thermal Conduction Analysis of a Rectangular Plate with Multiple Insulated Cracks by Alternating Method
|
張志毅; 馬劍清; CHIEN-CHING MA |
| 臺大學術典藏 |
2018-09-10T03:45:25Z |
Transient thermal conduction analysis of a rectangular plate with multiple insulated cracks by the alternating method
|
Ma, Chien-Ching;Chang, Chih-Yi;CHIEN-CHING MA;Ma, Chien-Ching;Chang, Chih-Yi;Ma, Chien-Ching;Chang, Chih-Yi;CHIEN-CHING MA; Chang, Chih-Yi; Ma, Chien-Ching; CHIEN-CHING MA; Chang, Chih-Yi; Ma, Chien-Ching |
| 國立臺灣大學 |
2001 |
Transient thermal conduction analysis of a rectangular plate with multiple insulated cracks by the alternating method
|
Chang, Chih-Yi; Ma, Chien-Ching |
| 國立交通大學 |
2020-10-05T02:01:30Z |
Transient Thermal Damage Simulation for Novel Location-Controlled Grain Technique in Monolithic 3D IC
|
Chen, Pin-Jun; Shen, Chih-Ming; Yang, Chih-Chao; Tai, Ming-Chi; Lo, Wei-Chung; Shen, Chang-Hong; Hu, Chenming; Chen, Kuan-Neng |
| 國立成功大學 |
2015-08 |
TRANSIENT THERMAL ENERGY STORAGE IN A PARTITIONED ENCLOSURE PACKED WITH MEPCM
|
SIAO, Yong-Hao; YAN, Wei-Mon; LAI, Chi-Ming; LIN, Yu-Fan |
| 國立成功大學 |
2001 |
Transient thermal stress analysis of multilayered hollow cylinder
|
Lee, Zong-Yi; Chen, Cha'o-Kuang; Hung, Chen-I |
| 國立成功大學 |
2021-12-7 |
Transient thermal stress analysis of temperature-dependent anisotropic viscoelastic solids
|
Su;Hsuan, Chin;Hwu;Chyanbin;Nguyen;Thuong, Van |
| 修平科技大學 |
2001 |
Transient Thermal Stresses Analysis of Multilayered Hollow Cylinder.
|
Chen, C. K.;Hung, C. I.;Lee, Z. Y. |
| 國立交通大學 |
2014-12-08T15:04:40Z |
TRANSIENT THERMAL-CONVECTION IN AN ENCLOSURE INDUCED SIMULTANEOUSLY BY GRAVITY AND VIBRATION
|
FU, WS; SHIEH, WJ |
| 國立交通大學 |
2014-12-08T15:05:55Z |
TRANSIENT THERMAL-STRESSES DUE TO PERIODIC MOVING FRICTIONAL LOAD IN LAYERED MEDIA
|
CHEN, LS; CHU, HS |
| 國立交通大學 |
2014-12-08T15:05:42Z |
TRANSIENT THERMAL-STRESSES DUE TO PERIODICALLY MOVING LINE HEAT-SOURCE OF COMPOSITE HOLLOW CYLINDER
|
CHEN, LS; CHU, HS |
| 國立交通大學 |
2014-12-08T15:05:53Z |
TRANSIENT THERMAL-STRESSES OF A COMPOSITE HOLLOW CYLINDER HEATED BY A MOVING LINE SOURCE
|
CHEN, LS; CHU, HS |
