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| 國立交通大學 |
2017-04-21T06:49:12Z |
Ultrathin Glass Wafer Lamination and Laser Debonding to Enable Glass Interposer Fabrication
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Shen, Wen-Wei; Chang, Hsiang-Hung; Wang, Jen-Chun; Ko, Cheng-Ta; Tsai, Leon; Wang, Bor Kai; Shorey, Aric; Lee, Alvin; Su, Jay; Bai, Dongshun; Huang, Baron; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立臺灣大學 |
2005 |
具CaCu5結構之三元稀土銅鋁合金的電磁性質研究
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王柏凱; Wang, Bor-Kai |
| 國立成功大學 |
2004-06-01 |
Temperature dependence of the resonant tunneling fields in high-spin molecules
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Tsai, Hui-Lien; Chang, Ching-Ray; Cheng, Tai-Chung; Jwo, Tyn-Yih; Wang, Bor-Kai |
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