| 元智大學 |
Aug-16 |
Electromigration in 3D-IC Scale Cu/Sn/Cu Solder Joints
|
Cheng-En Ho; Pei-Tzu Lee; Chih-Nan Chen; Cheng-Hsien Yang |
| 國立交通大學 |
2014-12-08T15:25:35Z |
Electromigration in eutectic SnPb solder bumps with Ni/Cu UBM
|
Chiu, SH; Liang, SW; Chen, C; Lin, SS; Chou, CM; Liu, YC; Chen, KH |
| 國立臺灣大學 |
2010 |
Electromigration in flip chip solder joints under extra high current density
|
Lin, Y.W.; Ke, J.H.; Chuang, H.Y.; Lai, Y.S.; Kao, C.R. |
| 國立交通大學 |
2017-04-21T06:49:07Z |
Electromigration in microbumps with Cu-Sn intermetallic compounds
|
Chu, Yi-Cheng; Zhan, Chau-Jie; Lin, Han-Wen; Huang, Yu-Wei; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:18:38Z |
Electromigration in pb-free SnAg3.8Cu0.7 solder stripes
|
Hsu, YC; Chou, CK; Liu, PC; Chen, C; Yao, DJ; Chou, T; Tu, KN |
| 國立交通大學 |
2017-04-21T06:49:40Z |
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
|
Nah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:56:47Z |
Electromigration in reduced-height solder joints with Cu pillars
|
Chen, Ming-Yao; Liang, Y. C.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:10:08Z |
Electromigration in Sn-Cu intermetallic compounds
|
Wei, C. C.; Chen, C. F.; Liu, P. C.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:39:26Z |
Electromigration in sputtered copper film on plasma-treated hydrogen silsesquioxane dielectric
|
Chen, CT; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:46:34Z |
Electromigration in sputtered copper films on polyimide
|
Wang, HW; Chiou, BS; Jiang, JS |
| 國立交通大學 |
2014-12-08T15:27:07Z |
Electromigration in sputtered copper interconnection with polyimide as interlevel dielectric or passivation
|
Chiou, BS; Jiang, JS; Wang, HW; Hung, HY |
| 國立臺灣大學 |
2007 |
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads
|
Lin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N. |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads
|
TUNG-HAN CHUANG; Tu, K.N.; Chuang, T.H.; Lin, S.Z.; Wu, A.T.; Lin, W.H. |
| 元智大學 |
Nov-14 |
Electromigration in Thin-film Solder Joints
|
Cheng-En Ho; Cheng-Hsien Yang; Ling-Huang Hsu |
| 元智大學 |
2015-10-21 |
Electromigration in Tin Blech Structure
|
W. Z. Hsieh; P. T. Lee; Cheng-En Ho |
| 臺大學術典藏 |
2019-11-27T02:03:08Z |
Electromigration in tin thin film
|
C. ROBERT KAO;Kao C.R.;Wan S.W.;Hu Y.C.; Hu Y.C.; Wan S.W.; Kao C.R.; C. ROBERT KAO |
| 國立中山大學 |
2009 |
Electromigration in tin-copper, tin-silver, and eutectic tin-lead flip chip solder joints
|
L. Xu;J. Liang;J.K. Han;Y.S. Lai;K.N. Tu |
| 國立臺灣大學 |
2005-01 |
Electromigration induced failure in flip chip solder joints
|
Lin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Kao, and C. R. |
| 國立交通大學 |
2014-12-08T15:26:28Z |
Electromigration induced failure in SnAg3.8Cu0.7 solder joints for flip chip technology
|
Hsu, YC; Shao, TL; Chen, C |
| 國立交通大學 |
2014-12-08T15:14:37Z |
Electromigration issues in lead-free solder joints
|
Chen, Chih; Liang, S. W. |
| 國立交通大學 |
2014-12-08T15:17:56Z |
Electromigration lifetime improvement of copper interconnect by cap/dielectric interface treatment and geometrical design
|
Lin, MH; Lin, YL; Chen, JM; Yeh, MS; Chang, KP; Su, KC; Wang, TH |
| 國立交通大學 |
2019-04-03T06:41:32Z |
Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
|
Chang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立高雄應用科技大學 |
1975-03 |
Electromigration Mechanisms in Thin Film Conductors
|
H. L. Huang; Chi-Yang Chang; 黃暉理; 張啟陽 |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads
|
Lin, H.-J.; Lin, J.-S.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 國立東華大學 |
2004 |
Electromigration of Sn-Zn solders in Contact with Cu
|
宋振銘; 林光隆; 方彥翔 |
