| 國立成功大學 |
2008-11 |
Electromechanical fracture analysis for corners and cracks in piezoelectric materials
|
Hwu, Chyanbin; Ikeda, T. |
| 臺大學術典藏 |
2021-04-21T23:29:53Z |
Electromechanical properties of embedded multifunctional energy storage composite with activated carbon fiber/PVDF gel electrolyte
|
HSUN-YI CHEN; Wu, Cheng Yan; Hsueh, Yu Ting; HSIN-HAOU HUANG |
| 臺大學術典藏 |
2021-07-26T10:01:33Z |
Electromechanical properties of embedded multifunctional energy storage composite with activated carbon fiber/PVDF gel electrolyte
|
Chen H.-Y;Wu C.-Y;Hsueh Y.-T;Huang H.-H.; Chen H.-Y; Wu C.-Y; Hsueh Y.-T; Huang H.-H.; HSUN-YI CHEN |
| 臺大學術典藏 |
2021-08-05T02:40:32Z |
Electromechanical properties of embedded multifunctional energy storage composite with activated carbon fiber/PVDF gel electrolyte
|
Chen H.-Y;Wu C.-Y;Hsueh Y.-T;Huang H.-H.; Chen H.-Y; Wu C.-Y; Hsueh Y.-T; Huang H.-H.; HSIN-HAOU HUANG |
| 臺大學術典藏 |
2020-06-16T06:32:14Z |
Electromechanical properties of MgZnO/ZnO heterostructures on flexible polyimide and stainless steel substrates under flexing
|
Wu, T.-H.;Chen, J.-Z.;Hsu, C.-C.;Cheng, I.-C.; Wu, T.-H.; Chen, J.-Z.; Hsu, C.-C.; Cheng, I.-C.; I-CHUN CHENG |
| 中國醫藥大學 |
2013-06 |
Electromechanical Relationship in Hypertrophic Cardiomyopathy
|
(Xiaoping Lin);梁馨月(Hsin-Yueh Liang);(Aurelio Pinheiro);(Veronica Dimaano);(Lars Sorensen);(Miguel Aon);(Larisa G. Tereshchenko);(Yihan Chen);(Yihan Chen);(Theodore P. Abraham);(M. Roselle Abraham)* |
| 國立臺灣大學 |
2005 |
Electromechanical responses of single-walled carbon nanotubes: Interplay between the strain-induced energy-gap opening and the pinning of the Fermi level
|
Guo, G. Y.; Liu, Lei; Chu, K. C.; Jayanthi, C. S.; Wu, S. Y. |
| 國立臺灣大學 |
2010-03 |
Electromechanical Stability of Flexible Nanocrystalline Silicon Thin Film Transistors
|
Chiu, I-Chung; Jung-Jie; Huang; Chen, Yung-Pei; Cheng, I-Chun; Chen, Jian Z.; Lee, Min-Hung |
| 臺大學術典藏 |
2020-06-16T06:32:15Z |
Electromechanical stability of flexible nanocrystalline-silicon thin-film transistors
|
Chiu, I.-C.;Huang, J.-J.;Chen, Y.-P.;Cheng, I.-C.;Chen, J.Z.;Lee, M.-H.; Chiu, I.-C.; Huang, J.-J.; Chen, Y.-P.; Cheng, I.-C.; Chen, J.Z.; Lee, M.-H.; I-CHUN CHENG |
| 臺大學術典藏 |
2018-09-10T06:58:30Z |
Electromechanical valve actuator with hybrid MMF for camless engine
|
Liu, J.-J.; Yang, Y.-P.; Xu, J.-H.; YEE-PIEN YANG |
| 臺大學術典藏 |
2021-11-08T09:20:25Z |
Electromechanics and Electrorheology of Fluid Flow with Internal Micro-particle Electrorotation
|
Hsin-Fu Huang; HSIN-FU HUANG |
| 臺大學術典藏 |
2000 |
Electrometer for intracellular and extracellular recordings
|
Jaw, Fu-Shan; Lai, Ming-Liang; Kuo, Te-Son; Lai, Ming-Liang;Kuo, Te-Son;Jaw, Fu-Shan |
| 國立臺灣大學 |
2000 |
Electrometer for intracellular and extracellular recordings
|
Lai, Ming-Liang; Kuo, Te-Son; Jaw, Fu-Shan |
| 南台科技大學 |
1998-06 |
Electromethoxylation of Diethyl 2-Hydroxyazulene 1,3-Dicarboxylate and 2-Amino-1,3-Dicyanoazulene
|
陳阿煌; A. H. Chen ; T. Nozoe |
| 義守大學 |
2010-08 |
Electromigration Analysis and Electro-Thermo-Mechanical Design for Package-on-Package (POP)
|
Hsiang-Chen Hsu;Shen-Wen Ju;Jie-Rong Lu;Yue-Min Wan |
| 義守大學 |
2009/08/10 |
Electromigration analysis and electro-thermo-mechanical design for semiconductor package
|
Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Hong-Shen Chang ; Hong-Hau Wu |
| 國立交通大學 |
2014-12-08T15:38:51Z |
Electromigration and integration aspects for the copper-SiLK system
|
Tseng, HS; Chiou, BS; Wu, WF; Ho, CC |
| 國立交通大學 |
2014-12-08T15:07:45Z |
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
|
Chen, Chih; Tong, H. M.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:39:39Z |
Electromigration at the high-Pb-eutectic SnPb solder interface
|
Lai, CL; Lin, CH; Chen, C |
| 國立成功大學 |
2008-01 |
Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立交通大學 |
2014-12-08T15:32:14Z |
Electromigration behaviors of Ge2Sb2Te5 chalcogenide thin films under DC bias
|
Huang, Yin-Hsien; Hang, Chi-Hang; Huang, Yu-Jen; Hsieh, Tsung-Eong |
| 東海大學 |
1991 |
Electromigration effect on low frequency noise in Al thin films
|
Liou, D.M., Gong, J., Chen, C.C. |
| 國立成功大學 |
2019-12 |
Electromigration effect upon single- and two-phase Ag-Cu alloy strips: An in situ study
|
林士剛; LIN, SHIH-KANG;Liu, Yu-chen;Yu, Yung-si;Chiu, Shang-Jui |
| 國立成功大學 |
2019-12 |
Electromigration effect upon single- and two-phase Ag-Cu alloy strips: An in situ study
|
Liu;Yu-chen;Yu;Yung-si;Lin;Shih-kang;Chiu;Shang-Jui |
| 國立臺灣大學 |
2003-11 |
Electromigration failure in flip chip solder joints due to rapid dissolution of copper
|
Hu, Y. C.; Lin, Y. H.; Kao, C. R.; Tu, K. N. |
