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Institution	Date	Title	Author
國立交通大學	2019-04-02T06:04:52Z	Packaging Effect on the Flow Separation of CMOS Thermoresistive Micro Calorimetric Flow Sensors	Xu, Wei; Gao, Bo; Lee, Yi-Kuen; Chiu, Yi
國立中山大學	2009-05	Packaging effects on degrading the figure of merit of a CMOS low-noise amplifier: flip-chip versus wirebond	F.Y. Han;K.C. Lu;T.S. Horng;J.Y. Li;C.C. Chen;H.H. Chen;C.T. Chiu;C.P Hung
國立中山大學	2009-06	Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: flip-chip versus wire-bond	F.Y. Han;K.C. Lu;T.S. Horng;J. Lin;H.H. Cheng;C.T. Chiu;C.P. Hung
國立臺灣科技大學	2014	Packaging efficiency in phosphor-converted white LEDs and its impact to the limit of luminous efficacy	Sun, C.-C.;Chang, Y.-Y.;Yang, T.-H.;Chung, T.-Y.;Chen, C.-C.;Lee, T.-X.;Li, D.-R.;Lu, C.-Y.;Ting, Z.-Y.;Glorieux, B.;Chen, Y.-C.;Lai, K.-Y.;Liu, C.-Y.
國立臺灣大學	2005	Packaging Methods of Fiber Bragg Grating Sensors in Civil Structure Applications	Lin, Y. B.; Chang, K. C.; Chern, J. C.; Wang, L.
國立臺灣大學	2005-02	Packaging Methods of Fiber Bragg Grating Sensors in Civil Structure Applications	Lin, Y. B.; Chang, K. C.; Chern, J. C.; Wang, L.
臺大學術典藏	2005	Packaging methods of fiber-Bragg grating sensors in civil structure applications	Lin, Yung Bin; Chang, Kuo Chun; Chern, Jenn Chuan; Wang, L.A.; Lin, Yung Bin; Chang, Kuo Chun; Chern, Jenn Chuan; Wang, L.A.
國立臺灣大學	2005	Packaging methods of fiber-Bragg grating sensors in civil structure applications	Lin, Yung Bin; Chang, Kuo Chun; Chern, Jenn Chuan; Wang, L.A.
臺大學術典藏	2018-09-10T05:29:04Z	Packaging methods of fiber-Bragg grating sensors in civil structure applications	Y. B. Lin,; K. C. Chang,; J. C. Chern,; L. A. Wang,; LON A. WANG
臺大學術典藏	2021-02-02T07:51:06Z	Packaging of hepatitis delta virus RNA via the RNA-binding domain of hepatitis delta antigens: Different roles for the small and large delta antigens	Wang H.-W.; Chen P.-J.; Lee, Cha-Ze; Wu H.L.; Chen D.-S.

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