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机构 日期 题名 作者
國立交通大學 2019-04-02T06:04:52Z Packaging Effect on the Flow Separation of CMOS Thermoresistive Micro Calorimetric Flow Sensors Xu, Wei; Gao, Bo; Lee, Yi-Kuen; Chiu, Yi
國立中山大學 2009-05 Packaging effects on degrading the figure of merit of a CMOS low-noise amplifier: flip-chip versus wirebond F.Y. Han;K.C. Lu;T.S. Horng;J.Y. Li;C.C. Chen;H.H. Chen;C.T. Chiu;C.P Hung
國立中山大學 2009-06 Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: flip-chip versus wire-bond F.Y. Han;K.C. Lu;T.S. Horng;J. Lin;H.H. Cheng;C.T. Chiu;C.P. Hung
國立臺灣科技大學 2014 Packaging efficiency in phosphor-converted white LEDs and its impact to the limit of luminous efficacy Sun, C.-C.;Chang, Y.-Y.;Yang, T.-H.;Chung, T.-Y.;Chen, C.-C.;Lee, T.-X.;Li, D.-R.;Lu, C.-Y.;Ting, Z.-Y.;Glorieux, B.;Chen, Y.-C.;Lai, K.-Y.;Liu, C.-Y.
國立臺灣大學 2005 Packaging Methods of Fiber Bragg Grating Sensors in Civil Structure Applications Lin, Y. B.; Chang, K. C.; Chern, J. C.; Wang, L.
國立臺灣大學 2005-02 Packaging Methods of Fiber Bragg Grating Sensors in Civil Structure Applications Lin, Y. B.; Chang, K. C.; Chern, J. C.; Wang, L.
臺大學術典藏 2005 Packaging methods of fiber-Bragg grating sensors in civil structure applications Lin, Yung Bin; Chang, Kuo Chun; Chern, Jenn Chuan; Wang, L.A.; Lin, Yung Bin; Chang, Kuo Chun; Chern, Jenn Chuan; Wang, L.A.
國立臺灣大學 2005 Packaging methods of fiber-Bragg grating sensors in civil structure applications Lin, Yung Bin; Chang, Kuo Chun; Chern, Jenn Chuan; Wang, L.A.
臺大學術典藏 2018-09-10T05:29:04Z Packaging methods of fiber-Bragg grating sensors in civil structure applications Y. B. Lin,; K. C. Chang,; J. C. Chern,; L. A. Wang,; LON A. WANG
臺大學術典藏 2021-02-02T07:51:06Z Packaging of hepatitis delta virus RNA via the RNA-binding domain of hepatitis delta antigens: Different roles for the small and large delta antigens Wang H.-W.; Chen P.-J.; Lee, Cha-Ze; Wu H.L.; Chen D.-S.

显示项目 648391-648400 / 2348487 (共234849页)
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每页显示[10|25|50]项目