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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 355276-355285 / 2348973 (共234898页)
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| 國立臺灣大學 |
2002-06 |
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
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Ho, C. E.; Tsai, R. Y.; Lin, Y. L.; Kao, and C. R. |
| 國立臺灣大學 |
2010 |
Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni
|
Yang, S.C.; Chang, C.C.; Tsai, M.H.; Kao, C.R. |
| 臺大學術典藏 |
2020-04-28T07:11:48Z |
Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni
|
Tsai, M. H.; Kao, C. R.; CHIEN-CHENG CHANG; Chang, C. C.; Yang, S. C. |
| 淡江大學 |
2003 |
Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization
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Hsu, S. C.; Wang, S. J.; Liu, C. Y. |
| 國立成功大學 |
2022-10 |
Effect of Cu Intercalation Layer on the Enhancement of Spin-to-Charge Conversion in Py/Cu/Bi2Se3
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Su;Hsuan, Shu;Chong;Cheong-Wei;Lee;Jung-Chuan;Chen;Yi-Chun;Marchenkov;Viktorovich, Vyacheslav;Huang;Andrew, Jung-Chun |
| 元智大學 |
2019/11/15 |
Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz
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W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho |
| 元智大學 |
2019/11/15 |
Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz
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W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho |
| 國立高雄大學 |
2010-07 |
Effect of Cu species on leaching behavior of simulated copper sludge after thermal treatment: ESCA analysis
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Chou, Jing-Dong; Lin, Chiou-Liang; Wey, Ming-Yen; Chang, Shih-Hsien |
| 中山醫學大學 |
2010-07 |
Effect of Cu species on leaching behavior of simulated copper sludge after thermal treatment: ESCA analysis.
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Chou JD;Lin CL;Wey MY;Chang SH |
| 國立交通大學 |
2014-12-08T15:07:51Z |
Effect of Cu-Ion Concentration in Concentrated H(3)PO(4) Electrolyte on Cu Electrochemical Mechanical Planarization
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Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
显示项目 355276-355285 / 2348973 (共234898页)
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每页显示[10|25|50]项目
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