|
English
|
正體中文
|
简体中文
|
总笔数 :2856565
|
|
造访人次 :
53393247
在线人数 :
979
教育部委托研究计画 计画执行:国立台湾大学图书馆
|
|
|
显示项目 381031-381040 / 2348973 (共234898页)
<< < 38099 38100 38101 38102 38103 38104 38105 38106 38107 38108 > >>
每页显示[10|25|50]项目
| 國立中山大學 |
2009 |
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints
|
M.H. R. Jen;L.C. Liu;Y.S. Lai |
| 國立中山大學 |
2009 |
Electromigration reliability characterization in ASE: A state-of-the-art review
|
Y.S. Lai |
| 國立中山大學 |
2009 |
Electromigration reliability characterization in ASE: A state-of-the-art review
|
Y.S. Lai |
| 國立中山大學 |
2009 |
Electromigration reliability of 96.5Sn-3Ag-0.5Cu flip-chip solder joints with Au/Ni/Cu or Cu substrate pad metallization
|
Y.S. Lai;Y.T. Chiu;C.W. Lee |
| 國立成功大學 |
2020- |
Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-mu m L/S Cu Redistribution Lines
|
Liang;Chien-Lung;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Wang;Shan-Bo;Hung;Yun-Ching;Lin;Gao-Tian;Lin;Kwang-Lung |
| 國立成功大學 |
2020 |
Electromigration Reliability of Advanced High-Density Fan-Out Packaging with Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines
|
Liang, C.-L.;Lin, Y.-S.;Kao, C.-L.;Tarng, D.;Wang, S.-B.;Hung, Y.-C.;Lin, G.-T.;Lin, K.-L. |
| 元智大學 |
2022-10-26 |
Electromigration Reliability of Micro Joints with Au/Pd(P)/Ni(P)/Cu Pads
|
C. Y. Lee; S. C. Chang; C. T. Chen; H. C. Liu; K. H. Lan; P C. Lin; Cheng-En Ho |
| 元智大學 |
2023/10/25 |
Electromigration Reliability of Micro Joints with Different Surface Finishes
|
Z. Y. Yang; S. C. Chang; C. T. Chen; W. Z. Hsieh; C. Y. Lee; H. C. Liu; K. H. Lan; P. C. Lin; Cheng-En Ho |
| 國立東華大學 |
2008-12 |
Electromigration Reliability with Respect to Cu Content in Solder Joint System
|
Song,J. M.; Lai,Yi-Shao |
| 國立交通大學 |
2014-12-08T15:40:08Z |
Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization
|
Shao, TL; Lin, KC; Chen, C |
显示项目 381031-381040 / 2348973 (共234898页)
<< < 38099 38100 38101 38102 38103 38104 38105 38106 38107 38108 > >>
每页显示[10|25|50]项目
|
