| 國立交通大學 |
2014-12-08T15:24:03Z |
Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish
|
Chu, Ming-Hui; Liang, S. W.; Chen, Chih; Huang, Annie T. |
| 國立交通大學 |
2014-12-08T15:25:59Z |
Electromigration failure mechanism of Sn96.5Ag3.5 flip-chip solder bumps
|
Shao, TL; Chen, IH; Chen, C |
| 國立交通大學 |
2014-12-08T15:37:26Z |
Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr-Cu/Cu and Ni(P)/Au metallization pads
|
Shao, TL; Chen, YH; Chiu, SH; Chen, C |
| 國立成功大學 |
2020 |
Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging
|
Liang, C.-L.;Lin, Y.-S.;Kao, C.-L.;Tarng, D.;Wang, S.-B.;Hung, Y.-C.;Lin, K.-L. |
| 國立交通大學 |
2017-04-21T06:49:13Z |
Electromigration Immortality of Purely Intermetallic Micro -bump for 3D Integration
|
Chen, Hsiao-Yun; Tung, Chih-Hang; Hsiao, Yi-Li; Wu, Jyun-lin; Yeh, Tung-Ching; Lin, Larry Liang-Chen; Chen, Chih; Yu, Douglas Cheng-Hua |
| 元智大學 |
Aug-16 |
Electromigration in 3D-IC Scale Cu/Sn/Cu Solder Joints
|
Cheng-En Ho; Pei-Tzu Lee; Chih-Nan Chen; Cheng-Hsien Yang |
| 國立交通大學 |
2014-12-08T15:25:35Z |
Electromigration in eutectic SnPb solder bumps with Ni/Cu UBM
|
Chiu, SH; Liang, SW; Chen, C; Lin, SS; Chou, CM; Liu, YC; Chen, KH |
| 國立臺灣大學 |
2010 |
Electromigration in flip chip solder joints under extra high current density
|
Lin, Y.W.; Ke, J.H.; Chuang, H.Y.; Lai, Y.S.; Kao, C.R. |
| 國立交通大學 |
2017-04-21T06:49:07Z |
Electromigration in microbumps with Cu-Sn intermetallic compounds
|
Chu, Yi-Cheng; Zhan, Chau-Jie; Lin, Han-Wen; Huang, Yu-Wei; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:18:38Z |
Electromigration in pb-free SnAg3.8Cu0.7 solder stripes
|
Hsu, YC; Chou, CK; Liu, PC; Chen, C; Yao, DJ; Chou, T; Tu, KN |
| 國立交通大學 |
2017-04-21T06:49:40Z |
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
|
Nah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:56:47Z |
Electromigration in reduced-height solder joints with Cu pillars
|
Chen, Ming-Yao; Liang, Y. C.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:10:08Z |
Electromigration in Sn-Cu intermetallic compounds
|
Wei, C. C.; Chen, C. F.; Liu, P. C.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:39:26Z |
Electromigration in sputtered copper film on plasma-treated hydrogen silsesquioxane dielectric
|
Chen, CT; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:46:34Z |
Electromigration in sputtered copper films on polyimide
|
Wang, HW; Chiou, BS; Jiang, JS |
| 國立交通大學 |
2014-12-08T15:27:07Z |
Electromigration in sputtered copper interconnection with polyimide as interlevel dielectric or passivation
|
Chiou, BS; Jiang, JS; Wang, HW; Hung, HY |
| 國立臺灣大學 |
2007 |
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads
|
Lin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N. |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads
|
TUNG-HAN CHUANG; Tu, K.N.; Chuang, T.H.; Lin, S.Z.; Wu, A.T.; Lin, W.H. |
| 元智大學 |
Nov-14 |
Electromigration in Thin-film Solder Joints
|
Cheng-En Ho; Cheng-Hsien Yang; Ling-Huang Hsu |
| 元智大學 |
2015-10-21 |
Electromigration in Tin Blech Structure
|
W. Z. Hsieh; P. T. Lee; Cheng-En Ho |
| 臺大學術典藏 |
2019-11-27T02:03:08Z |
Electromigration in tin thin film
|
C. ROBERT KAO;Kao C.R.;Wan S.W.;Hu Y.C.; Hu Y.C.; Wan S.W.; Kao C.R.; C. ROBERT KAO |
| 國立中山大學 |
2009 |
Electromigration in tin-copper, tin-silver, and eutectic tin-lead flip chip solder joints
|
L. Xu;J. Liang;J.K. Han;Y.S. Lai;K.N. Tu |
| 國立臺灣大學 |
2005-01 |
Electromigration induced failure in flip chip solder joints
|
Lin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Kao, and C. R. |
| 國立交通大學 |
2014-12-08T15:26:28Z |
Electromigration induced failure in SnAg3.8Cu0.7 solder joints for flip chip technology
|
Hsu, YC; Shao, TL; Chen, C |
| 國立交通大學 |
2014-12-08T15:14:37Z |
Electromigration issues in lead-free solder joints
|
Chen, Chih; Liang, S. W. |
