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显示项目 520911-520920 / 2348971 (共234898页)
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| 臺大學術典藏 |
2018-06-28T22:11:27Z |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
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Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH |
| 國立臺灣大學 |
2003 |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
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Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M. |
| 國立臺灣大學 |
2002 |
Intermetallic Compounds formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates
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Chan, Y. C.; Chiu, M. Y.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates
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Chan, Y.C.; Chiu, M.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Intermetallic compounds formed in In-3Ag solder BGA packages with ENIG and ImAg surface finishes
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Chuang, T.H.; Jain, C.C.; Wang, S.S.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2008 |
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads
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Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H. |
| 臺大學術典藏 |
2020-01-06T03:11:16Z |
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads
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Jain, C. C.; Wang, S. S.; Huang, K. W.; Chuang, T. H.; STEVEN SHENG-SHIH WANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads
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Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立交通大學 |
2019-04-03T06:42:01Z |
Intermetallic compounds in 3D integrated circuits technology: a brief review
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Annuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning |
| 國立臺灣大學 |
2006-02 |
Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Pads
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Chuang, T. H.; Yen, S. F.; Cheng, M. D. |
显示项目 520911-520920 / 2348971 (共234898页)
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