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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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顯示項目 355271-355280 / 2348973 (共234898頁)
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| 國立臺灣科技大學 |
2017 |
Effect of crystallographic orientation on single crystal copper nanogrooving behaviors by MD method
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Lin, Y.-C;Shiu, Y.-C. |
| 國立臺灣科技大學 |
2007 |
Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate
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Yen, Y.-W.;Liou, W.-K. |
| 元智大學 |
Jun-21 |
Effect of Cu and N co-doping in ZnO crystals through thermal processing on energy-level distribution
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黃鈺斌; Chau-Kuang Liau |
| 國立聯合大學 |
2010 |
Effect of Cu and Ni doping on the structure and magnetic properties of FePt nanoparticles
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S. W. Yung, J. S. Lin and S. P. Ju |
| 國立臺灣大學 |
2002-02 |
Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
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Chen, W. T.; Ho, C. E.; Kao, and C. R. |
| 國立臺灣大學 |
2002-06 |
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
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Ho, C. E.; Tsai, R. Y.; Lin, Y. L.; Kao, and C. R. |
| 國立臺灣大學 |
2010 |
Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni
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Yang, S.C.; Chang, C.C.; Tsai, M.H.; Kao, C.R. |
| 臺大學術典藏 |
2020-04-28T07:11:48Z |
Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni
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Tsai, M. H.; Kao, C. R.; CHIEN-CHENG CHANG; Chang, C. C.; Yang, S. C. |
| 淡江大學 |
2003 |
Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization
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Hsu, S. C.; Wang, S. J.; Liu, C. Y. |
| 國立成功大學 |
2022-10 |
Effect of Cu Intercalation Layer on the Enhancement of Spin-to-Charge Conversion in Py/Cu/Bi2Se3
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Su;Hsuan, Shu;Chong;Cheong-Wei;Lee;Jung-Chuan;Chen;Yi-Chun;Marchenkov;Viktorovich, Vyacheslav;Huang;Andrew, Jung-Chun |
顯示項目 355271-355280 / 2348973 (共234898頁)
<< < 35523 35524 35525 35526 35527 35528 35529 35530 35531 35532 > >>
每頁顯示[10|25|50]項目
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