| 國立交通大學 |
2014-12-08T15:27:07Z |
Electromigration in sputtered copper interconnection with polyimide as interlevel dielectric or passivation
|
Chiou, BS; Jiang, JS; Wang, HW; Hung, HY |
| 國立臺灣大學 |
2007 |
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads
|
Lin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N. |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads
|
TUNG-HAN CHUANG; Tu, K.N.; Chuang, T.H.; Lin, S.Z.; Wu, A.T.; Lin, W.H. |
| 元智大學 |
Nov-14 |
Electromigration in Thin-film Solder Joints
|
Cheng-En Ho; Cheng-Hsien Yang; Ling-Huang Hsu |
| 元智大學 |
2015-10-21 |
Electromigration in Tin Blech Structure
|
W. Z. Hsieh; P. T. Lee; Cheng-En Ho |
| 臺大學術典藏 |
2019-11-27T02:03:08Z |
Electromigration in tin thin film
|
C. ROBERT KAO;Kao C.R.;Wan S.W.;Hu Y.C.; Hu Y.C.; Wan S.W.; Kao C.R.; C. ROBERT KAO |
| 國立中山大學 |
2009 |
Electromigration in tin-copper, tin-silver, and eutectic tin-lead flip chip solder joints
|
L. Xu;J. Liang;J.K. Han;Y.S. Lai;K.N. Tu |
| 國立臺灣大學 |
2005-01 |
Electromigration induced failure in flip chip solder joints
|
Lin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Kao, and C. R. |
| 國立交通大學 |
2014-12-08T15:26:28Z |
Electromigration induced failure in SnAg3.8Cu0.7 solder joints for flip chip technology
|
Hsu, YC; Shao, TL; Chen, C |
| 國立交通大學 |
2014-12-08T15:14:37Z |
Electromigration issues in lead-free solder joints
|
Chen, Chih; Liang, S. W. |
| 國立交通大學 |
2014-12-08T15:17:56Z |
Electromigration lifetime improvement of copper interconnect by cap/dielectric interface treatment and geometrical design
|
Lin, MH; Lin, YL; Chen, JM; Yeh, MS; Chang, KP; Su, KC; Wang, TH |
| 國立交通大學 |
2019-04-03T06:41:32Z |
Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
|
Chang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立高雄應用科技大學 |
1975-03 |
Electromigration Mechanisms in Thin Film Conductors
|
H. L. Huang; Chi-Yang Chang; 黃暉理; 張啟陽 |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads
|
Lin, H.-J.; Lin, J.-S.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 國立東華大學 |
2004 |
Electromigration of Sn-Zn solders in Contact with Cu
|
宋振銘; 林光隆; 方彥翔 |
| 國立中山大學 |
2009 |
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints
|
M.H. R. Jen;L.C. Liu;Y.S. Lai |
| 國立中山大學 |
2009 |
Electromigration reliability characterization in ASE: A state-of-the-art review
|
Y.S. Lai |
| 國立中山大學 |
2009 |
Electromigration reliability characterization in ASE: A state-of-the-art review
|
Y.S. Lai |
| 國立中山大學 |
2009 |
Electromigration reliability of 96.5Sn-3Ag-0.5Cu flip-chip solder joints with Au/Ni/Cu or Cu substrate pad metallization
|
Y.S. Lai;Y.T. Chiu;C.W. Lee |
| 國立成功大學 |
2020- |
Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-mu m L/S Cu Redistribution Lines
|
Liang;Chien-Lung;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Wang;Shan-Bo;Hung;Yun-Ching;Lin;Gao-Tian;Lin;Kwang-Lung |
| 國立成功大學 |
2020 |
Electromigration Reliability of Advanced High-Density Fan-Out Packaging with Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines
|
Liang, C.-L.;Lin, Y.-S.;Kao, C.-L.;Tarng, D.;Wang, S.-B.;Hung, Y.-C.;Lin, G.-T.;Lin, K.-L. |
| 元智大學 |
2022-10-26 |
Electromigration Reliability of Micro Joints with Au/Pd(P)/Ni(P)/Cu Pads
|
C. Y. Lee; S. C. Chang; C. T. Chen; H. C. Liu; K. H. Lan; P C. Lin; Cheng-En Ho |
| 元智大學 |
2023/10/25 |
Electromigration Reliability of Micro Joints with Different Surface Finishes
|
Z. Y. Yang; S. C. Chang; C. T. Chen; W. Z. Hsieh; C. Y. Lee; H. C. Liu; K. H. Lan; P. C. Lin; Cheng-En Ho |
| 國立東華大學 |
2008-12 |
Electromigration Reliability with Respect to Cu Content in Solder Joint System
|
Song,J. M.; Lai,Yi-Shao |
| 國立交通大學 |
2014-12-08T15:40:08Z |
Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization
|
Shao, TL; Lin, KC; Chen, C |
