| 義守大學 |
2009/08/10 |
Electromigration analysis and electro-thermo-mechanical design for semiconductor package
|
Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Hong-Shen Chang ; Hong-Hau Wu |
| 國立交通大學 |
2014-12-08T15:38:51Z |
Electromigration and integration aspects for the copper-SiLK system
|
Tseng, HS; Chiou, BS; Wu, WF; Ho, CC |
| 國立交通大學 |
2014-12-08T15:07:45Z |
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
|
Chen, Chih; Tong, H. M.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:39:39Z |
Electromigration at the high-Pb-eutectic SnPb solder interface
|
Lai, CL; Lin, CH; Chen, C |
| 國立成功大學 |
2008-01 |
Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立交通大學 |
2014-12-08T15:32:14Z |
Electromigration behaviors of Ge2Sb2Te5 chalcogenide thin films under DC bias
|
Huang, Yin-Hsien; Hang, Chi-Hang; Huang, Yu-Jen; Hsieh, Tsung-Eong |
| 東海大學 |
1991 |
Electromigration effect on low frequency noise in Al thin films
|
Liou, D.M., Gong, J., Chen, C.C. |
| 國立成功大學 |
2019-12 |
Electromigration effect upon single- and two-phase Ag-Cu alloy strips: An in situ study
|
林士剛; LIN, SHIH-KANG;Liu, Yu-chen;Yu, Yung-si;Chiu, Shang-Jui |
| 國立成功大學 |
2019-12 |
Electromigration effect upon single- and two-phase Ag-Cu alloy strips: An in situ study
|
Liu;Yu-chen;Yu;Yung-si;Lin;Shih-kang;Chiu;Shang-Jui |
| 國立臺灣大學 |
2003-11 |
Electromigration failure in flip chip solder joints due to rapid dissolution of copper
|
Hu, Y. C.; Lin, Y. H.; Kao, C. R.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:24:03Z |
Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish
|
Chu, Ming-Hui; Liang, S. W.; Chen, Chih; Huang, Annie T. |
| 國立交通大學 |
2014-12-08T15:25:59Z |
Electromigration failure mechanism of Sn96.5Ag3.5 flip-chip solder bumps
|
Shao, TL; Chen, IH; Chen, C |
| 國立交通大學 |
2014-12-08T15:37:26Z |
Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr-Cu/Cu and Ni(P)/Au metallization pads
|
Shao, TL; Chen, YH; Chiu, SH; Chen, C |
| 國立成功大學 |
2020 |
Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging
|
Liang, C.-L.;Lin, Y.-S.;Kao, C.-L.;Tarng, D.;Wang, S.-B.;Hung, Y.-C.;Lin, K.-L. |
| 國立交通大學 |
2017-04-21T06:49:13Z |
Electromigration Immortality of Purely Intermetallic Micro -bump for 3D Integration
|
Chen, Hsiao-Yun; Tung, Chih-Hang; Hsiao, Yi-Li; Wu, Jyun-lin; Yeh, Tung-Ching; Lin, Larry Liang-Chen; Chen, Chih; Yu, Douglas Cheng-Hua |
| 元智大學 |
Aug-16 |
Electromigration in 3D-IC Scale Cu/Sn/Cu Solder Joints
|
Cheng-En Ho; Pei-Tzu Lee; Chih-Nan Chen; Cheng-Hsien Yang |
| 國立交通大學 |
2014-12-08T15:25:35Z |
Electromigration in eutectic SnPb solder bumps with Ni/Cu UBM
|
Chiu, SH; Liang, SW; Chen, C; Lin, SS; Chou, CM; Liu, YC; Chen, KH |
| 國立臺灣大學 |
2010 |
Electromigration in flip chip solder joints under extra high current density
|
Lin, Y.W.; Ke, J.H.; Chuang, H.Y.; Lai, Y.S.; Kao, C.R. |
| 國立交通大學 |
2017-04-21T06:49:07Z |
Electromigration in microbumps with Cu-Sn intermetallic compounds
|
Chu, Yi-Cheng; Zhan, Chau-Jie; Lin, Han-Wen; Huang, Yu-Wei; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:18:38Z |
Electromigration in pb-free SnAg3.8Cu0.7 solder stripes
|
Hsu, YC; Chou, CK; Liu, PC; Chen, C; Yao, DJ; Chou, T; Tu, KN |
| 國立交通大學 |
2017-04-21T06:49:40Z |
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
|
Nah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:56:47Z |
Electromigration in reduced-height solder joints with Cu pillars
|
Chen, Ming-Yao; Liang, Y. C.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:10:08Z |
Electromigration in Sn-Cu intermetallic compounds
|
Wei, C. C.; Chen, C. F.; Liu, P. C.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:39:26Z |
Electromigration in sputtered copper film on plasma-treated hydrogen silsesquioxane dielectric
|
Chen, CT; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:46:34Z |
Electromigration in sputtered copper films on polyimide
|
Wang, HW; Chiou, BS; Jiang, JS |
