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Institution	Date	Title	Author
國立交通大學	2017-04-21T06:49:40Z	Electromigration in Pb-free solder bumps with Cu column as flip chip joints	Nah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih
國立交通大學	2017-04-21T06:56:47Z	Electromigration in reduced-height solder joints with Cu pillars	Chen, Ming-Yao; Liang, Y. C.; Chen, Chih
國立交通大學	2014-12-08T15:10:08Z	Electromigration in Sn-Cu intermetallic compounds	Wei, C. C.; Chen, C. F.; Liu, P. C.; Chen, Chih
國立交通大學	2014-12-08T15:39:26Z	Electromigration in sputtered copper film on plasma-treated hydrogen silsesquioxane dielectric	Chen, CT; Chiou, BS
國立交通大學	2014-12-08T15:46:34Z	Electromigration in sputtered copper films on polyimide	Wang, HW; Chiou, BS; Jiang, JS
國立交通大學	2014-12-08T15:27:07Z	Electromigration in sputtered copper interconnection with polyimide as interlevel dielectric or passivation	Chiou, BS; Jiang, JS; Wang, HW; Hung, HY
國立臺灣大學	2007	Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads	Lin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N.
臺大學術典藏	2020-05-12T02:53:12Z	Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads	TUNG-HAN CHUANG; Tu, K.N.; Chuang, T.H.; Lin, S.Z.; Wu, A.T.; Lin, W.H.
元智大學	Nov-14	Electromigration in Thin-film Solder Joints	Cheng-En Ho; Cheng-Hsien Yang; Ling-Huang Hsu
元智大學	2015-10-21	Electromigration in Tin Blech Structure	W. Z. Hsieh; P. T. Lee; Cheng-En Ho

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