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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 381011-381020 / 2348973 (共234898页)
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每页显示[10|25|50]项目
| 國立交通大學 |
2017-04-21T06:49:40Z |
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
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Nah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:56:47Z |
Electromigration in reduced-height solder joints with Cu pillars
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Chen, Ming-Yao; Liang, Y. C.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:10:08Z |
Electromigration in Sn-Cu intermetallic compounds
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Wei, C. C.; Chen, C. F.; Liu, P. C.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:39:26Z |
Electromigration in sputtered copper film on plasma-treated hydrogen silsesquioxane dielectric
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Chen, CT; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:46:34Z |
Electromigration in sputtered copper films on polyimide
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Wang, HW; Chiou, BS; Jiang, JS |
| 國立交通大學 |
2014-12-08T15:27:07Z |
Electromigration in sputtered copper interconnection with polyimide as interlevel dielectric or passivation
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Chiou, BS; Jiang, JS; Wang, HW; Hung, HY |
| 國立臺灣大學 |
2007 |
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads
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Lin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N. |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads
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TUNG-HAN CHUANG; Tu, K.N.; Chuang, T.H.; Lin, S.Z.; Wu, A.T.; Lin, W.H. |
| 元智大學 |
Nov-14 |
Electromigration in Thin-film Solder Joints
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Cheng-En Ho; Cheng-Hsien Yang; Ling-Huang Hsu |
| 元智大學 |
2015-10-21 |
Electromigration in Tin Blech Structure
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W. Z. Hsieh; P. T. Lee; Cheng-En Ho |
显示项目 381011-381020 / 2348973 (共234898页)
<< < 38097 38098 38099 38100 38101 38102 38103 38104 38105 38106 > >>
每页显示[10|25|50]项目
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